1
Ronald Patrick Huemoeller, Russ Lie, David Hiner: Two-sided wafer escape package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, July 24, 2007: US07247523 (57 worldwide citation)

A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic compo ...


2
Ronald Patrick Huemoeller, Russ Lie, David Hiner: Two-sided wafer escape package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, September 2, 2008: US07420272 (53 worldwide citation)

A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic compo ...


3
Ronald Patrick Huemoeller, Russ Lie, David Hiner: Two-sided fan-out wafer escape package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, April 6, 2010: US07692286 (51 worldwide citation)

A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic compo ...


4
Ronald Patrick Huemoeller, David Jon Hiner, Russ Lie: Multi-level circuit substrate fabrication method. Amkor Technology, McKay and Hodgson, Serge J Hodgson, November 27, 2012: US08316536 (2 worldwide citation)

A method of making a semiconductor package substrate includes laser-ablating channels in the substrate. After the channels are ablated in the substrate, conductive material is added to fill the channels and cover the surface of the substrate. Then a photomask etching process simultaneously forms a c ...