1
Ronald W Gedney, Tamar A Sholtes: IC chip attachment. International Business Machines Corporation, Calfee Halter & Griswold, January 9, 1996: US05483421 (114 worldwide citation)

A package for mounting I/C chips onto a circuit board is provided. The chip has a surface array of input/output pads on one side which forms a footprint. A carrier is formed of an organic dielectric material having opposite surfaces. A first set of bonding pads is formed on one surface of the chip c ...


2
Stephen A Curtis, Ronald W Gedney, Gustav Schrottke: Free form packaging of specific functions within a computer system. International Business Machines Corporation, Mark E McBurney, March 30, 1993: US05198965 (80 worldwide citation)

A method and apparatus is provided for allowing computer functions formed on a flexible substrate to be adjacently stacked in layered relation. Each functional island will have an electrical connector on one end thereof. The electrical connector may include a plurality of conductive pads formed over ...


3
Ronald W Gedney, John Rasile: Integrated circuit package. International Business Machines Corporation, Paul M Brannen, February 7, 1978: US04072816 (25 worldwide citation)

A prepunched copper/dielectric laminate ground plane assembly is positioned on a metallized ceramic substrate having printed circuits on the surface thereof and provided with a plurality of circuit connection pins. Connection between the ground plane and the circuit connection pins is achieved by we ...