1
Ronald R Petkie: Brazeable metallizations for diamond components. Morgan Chemical Products, Bruce D Gray, Kristin D Mallatt, Kilpatrick Stockton, March 11, 2003: US06531226 (10 worldwide citation)

A multilayer brazeable metallization structure for diamond components is described. The brazeable metallization finds particular application for the attachment of diamond components such as heat spreaders in electronic packages that incorporate high power semiconductor devices. In the present invent ...


2
David S Hoover, Ronald R Petkie: CVD diamond enhanced microprocessor cooling system. Morgan Advanced Ceramics, Dean W Russell, Kristin M Crall, Kilpatrick Stockton, March 4, 2008: US07339791 (5 worldwide citation)

Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond h ...


3
Peter R Bossard, Ronald R Petkie: Composite structure for high efficiency hydrogen separation and its associated methods of manufacture and use. Lamorte & Associates, October 24, 2006: US07125440 (5 worldwide citation)

A hydrogen purification system and method that utilizes a hydrogen separator with a novel composite structure. The hydrogen separator has a first porous layer of a hydrogen permeable material, such as a palladium alloy. A solid layer of the same hydrogen permeable material is then disposed onto the ...


4
Ronald R Petkie: Thick film paste systems for circuits on diamond substrates. Morgan Chemical Products, Dean W Russell, Bruce D Gray, Kilpatrick Stockton, April 20, 2004: US06723420 (2 worldwide citation)

This invention relates to the nature of thick film compositions that are specifically designed for the fabrication of circuit elements on diamond substrates, especially resistive elements. The nature of diamond sheet material requires special consideration because of its relatively low coefficient o ...


5
Ronald R Petkie: Methods for thick films thermoelectric device fabrication. Berken Energy, Brownstein Hyatt Farber Schreck, Cara L Crowley Weber, February 17, 2015: US08956905 (1 worldwide citation)

Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and ...


6
Ronald R Petkie: Methods for thick films thermoelectric device fabrication. BERKEN ENERGY, Brownstein Hyatt Farber Schreck, Paul J Prendergast, Cara Crowley Weber, May 31, 2016: US09353445

Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and ...


7
Peter R Bossard, Ronald R Petkie: Composite structure for high efficiency hydrogen separation and its associated methods of manufacture and use. Lamorte & Associates PC, December 9, 2004: US20040244589-A1

A hydrogen purification system and method that utilizes a hydrogen separator with a novel composite structure. The hydrogen separator has a first porous layer of a hydrogen permeable material, such as a palladium alloy. A solid layer of the same hydrogen permeable material is then disposed onto the ...


8
David S Hoover, Ronald R Petkie: CVD diamond enhanced microprocessor cooling system. John S Pratt Esq, Kilpatrick Stockton, June 3, 2004: US20040105237-A1

Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond h ...


9
Ronald R Petkie: Thick film paste systems for circuits on diamond substrates. John S Pratt Esq, Kilpatrick Stockton, February 20, 2003: US20030035937-A1

This invention relates to the nature of thick film compositions that are specifically designed for the fabrication of circuit elements on diamond substrates, especially resistive elements. The nature of diamond sheet material requires special consideration because of its relatively low coefficient o ...