1
David Jon Hiner, Ronald Patrick Huemoeller, Sukianto Rusli: Method of manufacturing a semiconductor package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, March 6, 2007: US07185426 (255 worldwide citation)

A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die is mounted on an electrically conn ...


2
Christopher Marc Scanlan, Ronald Patrick Huemoeller: Semiconductor package including a top-surface metal layer for implementing circuit features. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, December 15, 2009: US07633765 (214 worldwide citation)

A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The ...


3
Ronald Patrick Huemoeller, Sukianto Rusli: Integrated circuit substrate having laser-embedded conductive patterns and method therefor. Amkor Technology, Weiss Moy & Harris P C, August 16, 2005: US06930256 (156 worldwide citation)

An integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. Conductive patterns within channels on the substrate provide interconnects that are isolated by the channel sides. A dielectric material is i ...


4
David Jon Hiner, Ronald Patrick Huemoeller, Sukianto Rusli: Semiconductor package including top-surface terminals for mounting another semiconductor package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, March 2, 2010: US07671457 (143 worldwide citation)

A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die is mounted on an electrically conn ...


5
Ronald Patrick Huemoeller, Roger D St Amand, Robert Francis Darveaux: Flip chip bump structure and fabrication method. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, April 26, 2011: US07932170 (127 worldwide citation)

A method includes forming a patterned buildup layer on a first surface of a dielectric layer, the patterned buildup layer including a patterned buildup layer opening exposing a trace coupled to the dielectric layer. A conductor layer is flash plated on the patterned buildup layer and within the patt ...


6
Ronald Patrick Huemoeller, Sukianto Rusli, David Jon Hiner: Buildup dielectric and metallization process and semiconductor package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, June 16, 2009: US07548430 (117 worldwide citation)

A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form an encapsulation. Via holes are laser-ablated through the encapsulation and conductive material is depo ...


7
Sukianto Rusli, Ronald Patrick Huemoeller, Bob Shih Wei Kuo, Lee John Smith: Ultra thin package and fabrication method. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, November 30, 2010: US07842541 (91 worldwide citation)

A method includes forming a substrate layer, the substrate layer including a circuit pattern having terminals and bump pads. A stiffener is formed, the stiffener including via apertures having electrically conductive via aperture sidewalls and an electronic component opening. The stiffener is attach ...


8
Ronald Patrick Huemoeller, Sukianto Rusli: Semiconductor package having substrate with laser-formed aperture through solder mask layer. Amkor Technology, James E Parsons, Skjerven Morrill, March 18, 2003: US06534391 (82 worldwide citation)

A semiconductor package and a method and a substrate for making the package are disclosed. The substrate of an exemplary package includes metal circuit patterns covered by a layer of an insulative nonphotoimageable solder mask material. A plurality of apertures are formed by laser ablation through t ...


9
Ronald Patrick Huemoeller, Sukianto Rusli, David Razu: Wafer level package and fabrication method. Amkor Technology, Gunnison McKay & Hodgson L, Philip J McKay, June 14, 2005: US06905914 (72 worldwide citation)

A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expos ...


10
Ronald Patrick Huemoeller, Sukianto Rusli, David Razu: Wafer level package and fabrication method. Amkor Technology, Gunnison McKay & Hodgson L, Philip J McKay, March 20, 2007: US07192807 (71 worldwide citation)

A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expos ...