1
Richard F Frankeny, Ronald L Imken: Chip edge interconnect overlay element. International Business Machines Corporation, Mark E McBurney, July 20, 1993: US05229916 (112 worldwide citation)

A chip overlay element is formed of a flexible substrate of polymer having electrically conductive material applied to one side thereof and circuitized to form signal lines. A metal stiffener/heat spreader is laminated to the polymer on the opposite side of the conductor. I/Os are formed on one end ...


2
Jerome A Frankeny, Richard F Frankeny, Karl Hermann, Ronald L Imken: Integrated circuit packaging using flexible substrate. International Business Machines Corporation, Wayne P Bailey, November 12, 1991: US05065227 (64 worldwide citation)

A multilayer, flexible substrate upon which integrated circuit chips can be attached is disclosed. The input/output(I/O) connections from the chip do not radiate outward from the side of the die, but rather extend from a bottom surface. Since the I/O signal lines would not be accessible for testing ...


3
Jerome A Frankeny, Richard F Frankeny, Ronald L Imken, Keith A Vanderlee: Method of making laminar stackable circuit board structure. International Business Machines Corporation, Casimer K Salys, April 23, 1996: US05509200 (49 worldwide citation)

Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a ...


4
Jerome A Frankeny, Richard F Frankeny, Javad Haj Ali Ahmadi, Karl Hermann, Ronald L Imken: High density interconnect strip. International Business Machines Corporation, Robert M Carwell, August 6, 1991: US05037311 (42 worldwide citation)

An interconnect strip is provided for effecting electrical interconnection between pluralities of conductor pads disposed on circuit boards or the like in a high density configuration. The strip is fabricated from a polymer film carrier having laminated thereon a metal foil with preselected spring p ...


5
Ronald L Imken, Joseph LaTorre: Aperture formation in aluminum circuit card for enhanced thermal dissipation. International Business Machines Corporation, Mark E McBurney, March 30, 1993: US05198693 (34 worldwide citation)

A method and system are provided for forming apertures in the dielectric layers of an aluminum circuit to allow electrical connection to the aluminum core and enhance the thermal efficiency of integrated circuit devices attached thereto. Specifically, the apertures are formed to accommodate the ICs ...


6
Richard F Frankeny, Ronald L Imken: Method for manufacturing electrically isolated polyimide coated vias in a flexible substrate. International Business Machines Corporation, Wayne P Bailey, May 31, 1994: US05316787 (28 worldwide citation)

A method and system for manufacturing electrically isolated vias in a flexible substrate composed of a metal core laminated by layers of an organic material. The method includes the steps of etching via holes, hydrolyzing the inner organic surfaces of the via holes and baking a polyimide solution co ...


7
Richard F Frankeny, Karl Hermann, Ronald L Imken, Joseph LaTorre: Manufacturing process of a high density substrate design. International Business Machines Corporation, Mark E McBurney, September 15, 1992: US05146674 (21 worldwide citation)

Substrate layers with individual bumps and cavities are provided which can be manufactured and tested in parallel and then joined into a multilayer substrate. The method of manufacturing these layers, as contemplated by the present invention, includes initially forming a plurality of vias in a layer ...


8
Jerome A Frankeny, Richard F Frankeny, Karl Hermann, Ronald L Imken: Modular component computer system. International Business Machines Corporation, Mark E McBurney, November 8, 1994: US05363275 (20 worldwide citation)

Discrete computational elements are provided that will be connected to a base unit, and to one another or I/O devices, in order to configure a particular computer system. The base unit provides the electrical power required to energize the computational elements. A plurality of identically configure ...


9
Richard F Frankeny, Javad Haj ali Ahmadi, Ronald L Imken, Rolf Wustrau: Zero insertion force high density connector system. International Business Machines Corporation, Robert M Carwell, July 24, 1990: US04943242 (8 worldwide citation)

A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulative strip carrying a plurality of buckling b ...


10
Ronald L Imken, Robert S Clough: Photoimageable dielectric material for circuit protection. 3M Innovative Properties Company, Darla P Fonseca, December 3, 2002: US06489042 (8 worldwide citation)

An electronic circuit device comprising at least one substrate having a photoimageable covercoat, comprising at least 95 weight percent of at least one epoxy-modified aromatic vinyl-conjugated diene block copolymer and a catalyst comprising an onium salt selected from a triarylsulfonium salt and a d ...