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Richard J Williams, Gregory K Duddoff, Ronald J Olson: Precision grid standoff for optical components on opto-electronic devices. Maine & Asmus, February 28, 2002: US20020025099-A1

In a method for incorporating an optical connector standoff structure in a semiconductor opto-electronic interface apparatus, an optical array chip (60) is flip-chip bonded to ASIC substrate (50), and electrically connected to its supporting circuitry through compressively joined solder bump sets (5 ...