1
Herbert S Cole, Raymond A Fillion, Bernard Gorowitz, Ronald F Kolc, Robert J Wojnarowski: Fabrication and structures of circuit modules with flexible interconnect layers. Martin Marietta Corporation, Geoffrey H Krauss, June 18, 1996: US05527741 (187 worldwide citation)

A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having c ...


2
Ronald F Kolc: Nozzle for dispensing viscous fluid. RCA Corporation, Samuel Cohen, Robert L Troike, Robert Ochis, September 29, 1981: US04291642 (21 worldwide citation)

A nozzle for use with a thick film dispensing system comprising a hollow tubular member having a fluid receiving port at one end and a fluid dispensing orifice at the other end. The hollow tubular member has a means coupled thereto for spacing and maintaining the fluid dispensing orifice a preselect ...