1
Roger P Stout: Voice coil linear motor with integral capacitor. Motorola, Paul F Wille, February 5, 1985: US04498023 (29 worldwide citation)

A voice coil linear motor is described in which the armature is supported on a linear bearing attached to the magnet assembly. The magnet assembly comprises a permanent magnet attached to two cup-shaped members which define a gap in which the armature travels. The armature comprises a coil, capaciti ...


2
Gerard H Michaud, James H Graham, Roger P Stout: Apparatus for and methods of die bonding. Kulicke & Soffa, Woodcock Washburn Kurtz Mackiewicz & Norris, January 17, 1989: US04797994 (19 worldwide citation)

Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to which it is to ...


3
Gerard H Michaud, James H Graham, Roger P Stout: Apparatus for and methods of die bonding. Kulicke & Soffa, Woodcock Washburn Kurtz Mackiewicz & Norris, October 31, 1989: US04876791 (7 worldwide citation)

This invention relates to apparatus for and methods of bonding a component to a substrate. More particularly, this invention relates to apparatus for and methods of removing small components, such a dies or other electrical components, from a wafer and bonding the components to a substrate.


4
Roger P Stout: Die pick mechanism for automatic assembly of semiconductor devices. Motorola, Joe E Barbee, Paul F Wille, June 7, 1988: US04749329 (7 worldwide citation)

Automatic assembly equipment for semiconductor devices comprises die or chip selection, transport, and bonding operations coordinated to obtain high production rates. Die selection means comprises a capillary and a needle, positioned on opposite sides of the wafer, which act together to lift the chi ...


5
Narayan Raja, Roger P Stout: Low thermal resistance semiconductor device and method therefor. Semiconductor Components Industries L L C, Robert F Hlghtower, November 21, 2006: US07138315

A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device.


6
Narayan Raja, Roger P Stout: Method of forming a low thermal resistance device and structure. Semiconductor Components Industries L L C, Robert F Hightower, April 4, 2006: US07022564

A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device.


7
Narayan Raja, Roger P Stout: Method of forming a low thermal resistance device and structure. Semiconductor Components, Mr Jerry Chruma, Semiconductor Components, April 20, 2006: US20060084210-A1

A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device.


8
Narayan Raja, Roger P Stout: Low thermal resistance semiconductor device and method therefor. Semiconductor Components, Mr Jerry Chruma, Semiconductor Components, April 20, 2006: US20060084228-A1

A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device.


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