1
Robert Smolley: Multi-element circuit construction. TRW, Noel F Heal, Robert M Wallace, April 8, 1986: US04581679 (94 worldwide citation)

A packaging construction for electronic circuit package elements, such as printed circuit boards and integrated-circuit chip packages, to obviate the need for connector cables, back-panel wiring and similar techniques. Circuit packaging elements are interconnected through an interconnection medium t ...


2
Robert Smolley: Multi-element circuit construction. TRW, Robert M Wallace, Noel F Heal, March 4, 1986: US04574331 (72 worldwide citation)

A packaging construction for electronic circuit package elements, such as printed circuit boards and integrated-circuit chip packages, to obviate the need for connector cables, back-panel wiring and similar techniques. Circuit packaging elements are interconnected through an interconnection medium t ...


3
Robert Smolley: Apparatus for testing I.C. chip. TRW, James M Steinberger, Sol L Goldstein, Robert J Stern, March 22, 1988: US04733172 (44 worldwide citation)

An improved test probe card for testing unpackaged integrated-circuit (IC) chips prior to installation of the chips in some type of electronic device. The test probe card includes a chip insulating board having openings at positions corresponding to contact areas of an IC chip and a test circuit boa ...


4
Robert Smolley: Backplane interconnection system. TRW, James M Steinberger, Ronald L Taylor, May 28, 1991: US05019945 (38 worldwide citation)

A backplane interconnection system for interconnecting an array of electronic components, such as integrated-circuit (IC) chip packages mounted on multilayer printed circuit boards. The backplane interconnection system includes an interface board and one or more interconnecting circuit board and a p ...


5
Robert Smolley: Liquid cooled high density packaging for high speed circuits. The United States of America represented by the Secretary of the Navy, David S Kalmbaugh, J M St Amand, July 11, 1989: US04847731 (31 worldwide citation)

High power dissipating micro electronic circuit chips are cooled in a high ensity package by mounting individual chips on sintered stainless steel pads and surrounding the micro chips with a liquid fluoro-chemical to achieve cooling. The chips are directly bonded to the sintered stainless steel pads ...


6
Robert Smolley: Packaging construction for semiconductor wafers. TRW, Ronald L Taylor, May 24, 1994: US05315481 (23 worldwide citation)

The present invention resides in a packaging construction for removably mounting and interconnecting semiconductor wafers with minimized interconnection lead lengths between the wafers and with a high packing density. The wafer packaging construction includes a multilayer printed circuit board, an i ...


7
Robert Smolley: Integrated-circuit chip interconnection system. TRW, James M Steinberger, Ronald L Taylor, April 16, 1991: US05007841 (22 worldwide citation)

An integrated-circuit (IC) chip packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board, without soldering, special tooling or special labor, and for interconnecting IC chips with minimized interconnection lead lengths between the ...


8
Robert Smolley: High-density contact area electrical connectors. TRW, James M Steinberger, Ronald L Taylor, April 16, 1991: US05007843 (22 worldwide citation)

An improved electrical connector for making electrical connections between electronic components. The improved electrical connector includes an insulating board interposed between metalized contact areas on the electronic components. The insulating board has openings at positions corresponding to th ...


9
Robert Smolley: Integrated circuit power distribution system. TRW, Ronald L Taylor, May 10, 1994: US05311058 (11 worldwide citation)

A power distribution system for distributing power to an IC is formed by attaching a grid having at least one power bus and one ground bus to the top surface of the IC die. The grid is adapted to be electrically coupled with power and ground pins in the IC's package The grid has an insulative layer ...


10
Robert Smolley: Packaging construction for very large scale integrated-circuit chips. TRW, Michael S Yatsko, November 2, 1999: US05977627 (3 worldwide citation)

A novel IC chip packaging construction in which the chip package materials are selected such that their thermal linear expansion curves are closely matched over the full operating temperature range of the IC chip. The IC chip packaging construction includes a metal base and cover for enclosing the I ...