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Raymond A Fillion, Robert J Wojnarowski, Michael Gdula, Herbert S Cole, Eric J Wildi, Wolfgang Daum: Method for fabricating an integrated circuit module. General Electric Company, Geoffrey H Krauss, October 11, 1994: US05353498 (693 worldwide citation)

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate ...


2
Charles W Eichelberger, Robert J Wojnarowski: Multichip integrated circuit packaging configuration and method. General Electric Company, Marvin Snyder, James C Davis Jr, November 8, 1988: US04783695 (332 worldwide citation)

A multichip integrated circuit package comprises a substrate to which is affixed one or more integrated circuit chips having interconnection pads. A polymer film overlying and bridging integrated circuit chips present is provided with a plurality of via openings to accommodate a layer of interconnec ...


3
Walter M Marcinkiewicz, Charles W Eichelberger, Robert J Wojnarowski: Compact high density interconnect structure. General Electric Company, Marvin Snyder, August 31, 1993: US05241456 (295 worldwide citation)

An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickn ...


4
Charles W Eichelberger, Robert J Wojnarowski: Capacitive touch entry apparatus having high degree of personal safety. General Electric Company, Geoffrey H Krauss, James C Davis, Marvin Snyder, September 15, 1981: US04290052 (192 worldwide citation)

A capacitive touch entry structure utilizes an array of at least one capacitive touch sensor fabricated upon a double-sided printed circuit board adhesively mounted upon a surface of a transparent insulative substrate. The substrate has sufficient thickness to safely insulate user personnel, contact ...


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Herbert S Cole, Raymond A Fillion, Bernard Gorowitz, Ronald F Kolc, Robert J Wojnarowski: Fabrication and structures of circuit modules with flexible interconnect layers. Martin Marietta Corporation, Geoffrey H Krauss, June 18, 1996: US05527741 (187 worldwide citation)

A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having c ...


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Robert J Wojnarowski: Method for thinning of integrated circuit chips for lightweight packaged electronic systems. General Electric Company, Geoffrey H Krauss, June 28, 1994: US05324687 (180 worldwide citation)

A method of thinning dice or integrated circuit chips used in producing lightweight packaged electronic systems, such as HDI circuits and systems produced therefrom provides for positioning dice in a die carrier layer that allows for easy separation from the dice after completion of the die thinning ...


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Charles W Eichelberger, Robert J Wojnarowski, Kenneth B Welles II: Laser beam scanning method for forming via holes in polymer materials. General Electric Company, Marvin Snyder, James C Davis Jr, January 16, 1990: US04894115 (155 worldwide citation)

The surface of a polymer dielectric layer is scanned repeatedly with a high energy continuous wave laser in a pattern to create via holes of desired size, shape and depth. This is followed by a short plasma etch. The via holes are produced at commercial production rates under direct computer control ...


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Charles W Eichelberger, Robert J Wojnarowski: Multichip integrated circuit packaging method. General Electric Company, Marvin Snyder, James C Davis Jr, April 24, 1990: US04918811 (149 worldwide citation)

A multichip integrated circuit package comprises a substrate to which is affixed one or more integrated circuit chips having interconnection pads. A polymer film overlying and bridging integrated circuit chips present is provided with a plurality of via openings to accommodate a layer of interconnec ...


9
Herbert S Cole Jr, Theresa A Sitnik Nieters, Robert J Wojnarowski, John H Lupinski: Reworkable high density interconnect structure incorporating a release layer. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, July 18, 1995: US05434751 (138 worldwide citation)

A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer ...


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