1
Raymond A Busacco, Fletcher W Chapin, David W Dranchak, Jaynal A Molla, George J Saxenmeyer Jr, Robert D Topa: Method of forming a conductive end portion on a flexible circuit member. International Business Machines Corporation, Lawrence R Fraley, August 24, 1993: US05237743 (52 worldwide citation)

A method of forming conductive end portions on a flexible circuit member having a dielectric layer (e.g., polyimide) with at least one conductive element (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, prov ...


2
Sung K Kang, Michael J Palmer, Timothy C Reiley, Robert D Topa: Thermocompression bonding in integrated circuit packaging. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, August 4, 1992: US05135155 (22 worldwide citation)

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approxi ...


3
Sung K Kang, Michael J Palmer, Timothy C Reiley, Robert D Topa: Thermocompression bonding in integrated circuit packaging. International Business Machines Corporation, April 9, 1991: US05006917 (20 worldwide citation)

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approxi ...


4
Francis J Downes Jr, Raymond T Galasco, Lawrence P Lehman, Robert D Topa: Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing. International Busines Machines Corporation, Arthur J Samodovitz Esq, Scully Scott Murphy & Presser, September 30, 2003: US06626196 (10 worldwide citation)

An arrangement and method for the degassing small high-aspect ratio drilled holes or vias which are present in panels such as printed circuit boards prior to wet chemical processing, including copper plating of the vias, in order to remove any air or gas bubbles from the vias tending to inhibit the ...


5
Sung K Kang, Michael J Palmer, Timothy C Reiley, Robert D Topa: Thermocompression bonding in integrated circuit packaging. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, September 7, 1993: US05242569 (6 worldwide citation)

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approxi ...


6
Sung K Kang, Michael J Palmer, Timothy C Reiley, Robert D Topa: Thermocompression bonding in integrated circuit packaging. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, September 15, 1992: US05148261 (4 worldwide citation)

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approxi ...


7
Madhav Datta, Raymond T Galasco, Lawrence P Lehman, Roy H Magnuson, Robin A Susko, Robert D Topa: Removal of metal skin from a copper-Invar-copper laminate. International Business Machines Corporation, Lawrence R Fraley, Schmeiser Olsen & Watts, May 8, 2001: US06228246 (3 worldwide citation)

A method of removing a metal skin from a through-hole surface of a copper-Invar-copper (CIC) laminate without causing differential etchback of the laminate. The metal skin includes debris deposited on the through-hole surface as the through hole is being formed by laser or mechanical drilling of a s ...


8
Timothy P Henning, Robert D Topa: Process for the deposition of palladium-nickel alloy. International Business Machines Corporation, Pollock Vande Sande & Priddy, January 14, 1986: US04564426 (3 worldwide citation)

A palladium-nickel alloy is deposited onto a substrate by electroplating from a plating bath containing palladosammine chloride, nickel ion source, ammonium sulfate, ammonium chloride, and sufficient ammonium hydroxide to provide a pH of about 7.0 to about 8.3 at a temperature of about 60.degree. F. ...


9
Sung K Kang, Michael J Palmer, Timothy C Reiley, Robert D Topa: Lead frame plating apparatus for thermocompression bonding. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, June 9, 1992: US05120418 (2 worldwide citation)

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approxi ...


10
Francis J Downes, Raymond T Galasco, Lawrence P Lehman, Robert D Topa: Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing. International Business Machines, Steven Fischman Esq, Scully Scott Murphy & Presser, December 19, 2002: US20020189637-A1

An arrangement and method for the degassing small high-aspect ratio drilled holes or vias which are present in panels such as printed circuit boards prior to wet chemical processing, including copper plating of the vias, in order to remove any air or gas bubbles from the vias tending to inhibit the ...