1
Rick Lake
Rick C Lake: Microelectronic devices and methods for manufacturing microelectronic devices. Micron Technology, Perkins Coie, January 4, 2011: US07863727 (8 worldwide citation)

Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic die, a plurality of electrical couplers projecting from the die, and a flowable material disposed on the die. The die includes an ...


2
Rick Lake
Rick C Lake, Ross S Dando: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, Perkins Coie, December 7, 2010: US07845540

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


3
Rick Lake
Warren M Farnworth, Rick C Lake, William M Hiatt: Microfeature workpieces having alloyed conductive structures, and associated methods. Micron Technology, Perkins Coie, January 28, 2014: US08637994

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic cons ...


4
Rick Lake
Warren M Farnworth, Rick C Lake, William M Hiatt: Microfeature workpieces having alloyed conductive structures, and associated methods. Micron Technology, January 3, 2013: US20130004792-A1

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic cons ...


5
Rick C Lake: Microelectronic devices and methods for manufacturing microelectronic devices. Micron Technology, Perkins Coie, December 3, 2013: US08597981 (1 worldwide citation)

Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic die, a plurality of electrical couplers projecting from the die, and a flowable material disposed on the die. The die includes an ...


6
Warren M Farnworth, Rick C Lake, William M Hiatt: Microfeature workpieces having alloyed conductive structures, and associated methods. Micron Technology, Perkins Coie, November 13, 2012: US08308053

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic cons ...


7
Rick C Lake: Methods for attaching microfeature dies to external devices. Micron Technology, Perkins Coie, January 19, 2010: US07648856

Methods for attaching microfeature dies to external devices are disclosed. The external devices can include other microfeature dies, support members or other suitable devices. A particular method includes attaching the solder to the at least one of the microfeature die in the support member by chang ...


8
Warren M Farnworth, Rick C Lake, William M Hiatt: Microfeature workpieces having alloyed conductive structures, and associated methods. Micron Technology, Perkins Coie, Patent Sea, March 1, 2007: US20070045388-A1

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic cons ...


9
Rick C Lake: Microelectronic devices and methods for manufacturing microelectronic devices. Micron Technology, Perkins Coie, Patent Sea, August 9, 2007: US20070181992-A1

Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic die, a plurality of electrical couplers projecting from the die, and a flowable material disposed on the die. The die includes an ...


10
Rick C Lake, Ross S Dando: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, Perkins Coie, Patent Sea, March 15, 2007: US20070057028-A1

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...



Click the thumbnails below to visualize the patent trend.