1
Fletcher W Chapin, David W Dranchak, David E Engle, Richard R Hall, Thomas G Macek: High density connector. International Business Machines Corporation, Lawrence R Fraley, October 29, 1991: US05061192 (142 worldwide citation)

An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening ...


2
Fletcher W Chapin, David W Dranchak, David E Engle, Richard R Hall, Thomas G Macek: High density connector. International Business Machines Corporation, Lawrence R Fraley, November 17, 1992: US05163834 (59 worldwide citation)

An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening ...


3
Benson Chan, Mitchell S Cohen, Paul F Fortier, Ladd W Freitag, Richard R Hall, Glen W Johnson, How Tzu Lin, John H Sherman: Fiber optic connections and method for using same. International Business Machines Corporation, Lawrence R Fraley, Salzman & Levy, March 30, 2004: US06712527 (45 worldwide citation)

A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly pac ...


4
Richard R Hall, How Tzu Lin: Self-aligning method and interlocking assembly for attaching an optoelectronic device to a coupler. International Business Machines Corporation, Lawrence R Fraley, Salzman & Levy, May 22, 2001: US06234687 (36 worldwide citation)

An assembly is described that consists of a gallium arsenide die chip and a fiber optic coupler bonded together about their respective mating surfaces. The chip includes laser light emitters. The fiber optic coupler has fiber optic light transmitters that require precise alignment with the laser lig ...


5
Benson Chan, Richard R Hall, How T Lin, John H Sherman: Multi-functional fiber optic coupler. Internation Business Machines Corporation, Lawrence R Fraley, Arthur J Samodovitz, October 21, 2003: US06635866 (26 worldwide citation)

An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a l ...


6
Benson Chan, Richard R Hall, How Tzu Lin, John H Sherman: Optical device with chip level precision alignment. International Business Machines Corporation, Lawrence R Fraley, Salzman & Levy, May 25, 2004: US06741778 (21 worldwide citation)

Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optica ...


7
Richard R Hall, How T Lin, Christopher J Majka, Matthew F Seward, Ronald V Smith: Solid conductive element insertion apparatus. International Business Machines Corporation, Arthur J Samodovitz, Scully Scott Murphy & Presser, March 30, 2004: US06712261 (16 worldwide citation)

An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining l ...


8
Benson Chan, Richard R Hall, John H Sherman, Candido C Tiberia: Electronic chip packaging. International Business Machines Corporation, Lawrence R Fraley, Salzman & Levy, February 19, 2002: US06349032 (14 worldwide citation)

An electronic package contains a circuit card to which a chip carrier plate is attached via solder balls. A heat spreader plate, supporting a heat sink, is spring loaded against the semiconductor chip of the carrier plate by means of elastomeric disks disposed upon a spring retainer plate that is, i ...


9
Michael A Acciai, Richard R Hall, John T Legg: Tooling for forming a stent. International Business Machines Corporation, Lawrence R Fraley, February 4, 2003: US06514063 (8 worldwide citation)

The present invention relates to a method and tooling for forming a stent and the stent so formed. The stent includes filaments of a first material and joints of a second material. The present invention also discloses the above described stent in combination with an angioplasty balloon. The tooling ...


10
Richard R Hall, How Tzu Lin, Candido C Tiberia: Fiber optic assembly. International Business Machines Corporation, Lawrence R Fraley, Salzman & Levy, October 29, 2002: US06471419 (7 worldwide citation)

A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular cor ...