1
James C K Lau, Richard P Malmgren, Kenneth Lui: Testing device for integrated circuits on wafer. TRW, December 26, 1995: US05479109 (113 worldwide citation)

An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible transparent d ...


2
Glen A Griffith, Richard P Malmgren: Laminated magnet keeper for implant device. Advanced Bionics Corporation, Bryant R Gold, January 23, 2001: US06178353 (102 worldwide citation)

An implantable medical device, such as an implantable cochlear stimulator (ICS) system, utilizes laminated, sectionalized or particle-ized permanent magnets and/or keepers in both the implant portion and external (non-implanted) portion so as to reduce the electrical energy absorbed by both the impl ...


3
Richard P Malmgren: Brazeless ceramic-to-metal bonding for use in implantable devices. Advanced Bionics Corporation, Fitch Even Tabin & Flannery, April 14, 1998: US05738270 (40 worldwide citation)

In method of forming a hermetically sealed electrical feedthrough comprising, a feedthrough is positioned in a hole, the hole passing through a structure. The feedthrough includes a first material and the structure including a second material. A compressive force directed at the structure is applied ...


4
Richard P Malmgren: Brazeless ceramic-to-metal bond for use in implantable devices. Advanced Bionics Corporation, Fitch Even Tabin & Flannery, May 7, 1996: US05513793 (31 worldwide citation)

In a method and apparatus for forming a hermetically sealed bond for use in implantable medical devices, a first structure, made from a first material, is positioned against a second structure, made from a second material. A compressive force directed at the second structure is applied to the first ...


5
Yoshio Saito, James C Lau, Steven S Chan, Richard P Malmgren: On-wafer integrated circuit electrical testing. TRW, August 9, 1994: US05336992 (28 worldwide citation)

An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible, supportive d ...


6
James C Lau, Kenneth Lui, Richard P Malmgren: Single crystal diamond wafer fabrication. TRW, Ronald L Taylor, March 1, 1994: US05290392 (14 worldwide citation)

This invention discloses a method of fabricating a plurality of diamond semiconductor wafers from a single crystal diamond semiconductor boule, where the diamond boule is grown by a chemical vapor deposition (CVD) process. Initially, a single crystal diamond seed is polished and an impurity layer is ...


7
Janusz A Kuzma, Lani A Smith, Richard P Malmgren: Hair clip retention system for headpiece of cochlear implant system. Advanced Bionics Corporation, Bryant R Gold, August 14, 2001: US06275736 (14 worldwide citation)

A hair clip for use with a cochlear implant system retains a headpiece assembly, including a transmitting coil, in an aligned position relative to an implanted stimulator. In one embodiment, the hair clip provides a retention system that uses a magnet which forms part of the transmitting coil. A com ...


8
James C Kei Lau, Richard P Malmgren, Ronald A DePace: Connector for integrated circuit chips. TRW, February 13, 1996: US05491304 (8 worldwide citation)

A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric ...


9
James C Lau, Richard P Malmgren, Kenneth Lui: Integrated waveguide/stripline transition. TRW, Ronald L Taylor, May 10, 1994: US05311153 (6 worldwide citation)

An integrated waveguide/stripline signal transition structure and method for fabricating the same are provided for allowing high frequency signal transitions. The signal transition structure includes a waveguide which has a conductive cavity for guiding electromagnetic waves therethrough. A first co ...


10
James C Kei Lau, Richard P Malmgren, Michael Roush: Massive parallel interconnection attachment using flexible circuit. TRW, January 17, 1995: US05382759 (6 worldwide citation)

An electrical interconnect and a method of fabricating an electrical interconnect are provided. A first transparent dielectric layer is disposed on top of a support structure. A conductive circuit layer is plated above the first dielectric layer. Separate conductive layers are plated on top of the c ...



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