1
Richard J Pommer, John Chiechi: Spring grid array interconnection for active microelectronic elements. UniStructure, Knobbe Martens Olson & Bear, May 1, 1990: US04922376 (107 worldwide citation)

A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures which extend through the retainer so that the elements are radially compressed. The retainer is disposed ...


2
Robert H Parker, Richard J Pommer: Integrated circuit component package with integral passive component. University of Southern California, Oppenheimer Poms Smith, May 27, 1997: US05633785 (56 worldwide citation)

A high-performance, high-density integrated circuit component package includes an IC chip having a plurality of IC bond pads and an interconnect substrate overlying the IC chip. The interconnect substrate includes a plurality of I/O surface pads arrayed across a surface of the interconnect substrate ...


3
Richard J Pommer: Method of manufacturing a printed circuit assembly. AlliedSignal, Blakely Sokoloff Taylor & Zafman, November 24, 1998: US05839188 (24 worldwide citation)

A printed circuit assembly and method of making the same utilize in one embodiment an adhesive layer including a plurality of non-conductive "gauge particles" disposed within a non-conductive adhesive. When the adhesive layer is disposed between opposing printed circuit layers (be they insulating su ...


4
Richard J Pommer, Jeffrey T Gotro, Nancy M W Androff, Marc D Hein, Corey J Zarecki: High density printed circuit substrate and method of fabrication. Isola Laminate Systems, McDonnell Boehnen Hulbert & Berghoff, June 5, 2001: US06242078 (19 worldwide citation)

The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric laye ...


5
David R Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard J Pommer: Lasable bond-ply materials for high density printed wiring boards. Honeywell International, Curtis B Brueske, June 12, 2001: US06245696 (17 worldwide citation)

This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.


6
Charles B Kuznia, Joseph F Ahadian, Richard T Hagan, Richard J Pommer: Fiber optic bi-directional coupling lens. Ultra Communications, TechLaw, Jonathan A Kidney, December 18, 2012: US08335411 (17 worldwide citation)

A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser l ...


7
Charles B Kuznia, Joseph F Ahadian, Richard T Hagan, Richard J Pommer: Fiber optic bi-directional coupling lens. Ultra Communications, May 13, 2014: US08724944 (11 worldwide citation)

A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser l ...


8
Richard J Pommer: Power conditioning substrate stiffener. Honeywell International, Robert D Fish, Rutan & Tucker, May 27, 2003: US06570250 (8 worldwide citation)

Utilization of the “dead space” previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as de-coupling capacitors and planar transformers.


9
Richard J Pommer: Printed circuit assembly having locally enhanced wiring density. Honeywell International, Curtis B Brueske, November 14, 2000: US06147870 (7 worldwide citation)

A printed circuit assembly and method of making the same facilitates the attachment of high density modules onto a printed circuit board. In one embodiment, the high density modules are attached to the printed circuit board using an adhesive having a conductive material disposed within at least one ...


10
Richard J Pommer: Alignment plate with matched thermal coefficient of expansion. Honeywell International, Robert D Fish, David J Zoetewey, Rutan & Tucker, May 13, 2003: US06560844 (4 worldwide citation)

Proper registration between layers of a laminated multi-layer interconnect can be achieved by precisely dimensioning the alignment plate, selecting the materials of which the alignment plate is composed to have the same thermal coefficient of expansion as the layers being laminated, and/or providing ...