1
Richard Allan Deckert, Steven Engelking, Joey Dean Evans: Integrated testing method and apparatus for semiconductor test operations processing. Sony Corporation, Sony Electronics, Wood Herron & Evans L, October 24, 2000: US06137303 (119 worldwide citation)

A semiconductor wafer testing and inspecting apparatus and method are provided in which a plurality of tests are performed on each of a plurality of wafers from a wafer cassette and before the wafers are returned to a packaging cassette or further processing. A carousel conveyor receives each wafer ...


2
Steven Engelking, Richard Allan Deckert, Joey Dean Evans: Method and apparatus for electrically testing semiconductor devices fabricated on a wafer. Sony Corporation, Sony Electronics, Ronald P Kananen, Rader Fishman & Grauer, July 10, 2001: US06259261 (67 worldwide citation)

A probe head replaces the probe card conventionally used to electrically test circuits on semiconductor wafers. Within the probe head, an array of pins is biased in a retracted position. A corresponding array of leads is biased in an extended position. By clamping a selector card with one or more ap ...


3
Steven Engelking, Richard Allan Deckert, Joey Dean Evans: Method and apparatus for polishing electrical probes. Sony Corporation, Sony Electronics, Ronald P Kananen, Rader Fishman & Grauer, March 20, 2001: US06203411

A probe polish burnishing assembly has a stem having a substantially spherical surface. This spherical surface makes intimate contact with the concave surfaces commonly present at the tips of set screws used to align the assembly, decreasing the likelihood of slippage and chipping of the stem. Align ...



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