1
John M Lauffer, Richard A Schumacher: Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards. IBM Corporation, Richard M Goldman, June 25, 1991: US05027253 (104 worldwide citation)

Disclosed is a multilayer circuit package having a buried thin film capacitor. The circuit package includes at least a power core, a ground core, a first signal core, a second signal core, and the integral, buried, thin film capacitor. The integral, buried, thin film capacitor serves to capacitively ...


2
Richard A Schumacher, Scott Lynn Michaelis: Communications connectors having frequency dependent communications paths and related methods. CommScope of North Carolina, Myers Bigel & Sibley P A, September 27, 2016: US09455765 (24 worldwide citation)

Communications connectors are provided that include a plurality of inputs that are arranged as differential pairs of inputs and a plurality of outputs that are arranged as differential pairs of outputs. A plurality of low frequency conductive paths are provided, each of which electrically connects a ...


3
Roy L Arldt, Christina M Boyko, Burtran J Cayson, Richard M Kozlowski, Joseph D Kulesza, John M Lauffer, Philip C Liu, Voya R Markovich, Issa S Mahmoud, James F Muska, Kostas Papathomas, Joseph G Sabia, Richard A Schumacher: Via fill compositions for direct attach of devices and methods for applying same. International Business Machines Corporation, Calfee Halter & Griswold, November 5, 1996: US05571593 (24 worldwide citation)

The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the ...


4
Bernd K Appelt, Irv Memis, Richard A Schumacher, John M Lauffer: Power carrier with selective thermal performance. International Business Machines Corporation, Pollock Vande Sande & Priddy, April 19, 1994: US05305186 (22 worldwide citation)

A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided. The thermal conduction means includes a first heat dissipation back plate means associated with the po ...


5
Burtran J Cayson, John A Covert, Steven A Duncan, John M Lauffer, Issa S Mahmoud, Richard A Schumacher: Method of reworking circuit panels, and circuit panels reworked thereby. International Business Machines Corporation, Richard M Goldman, May 25, 1993: US05214250 (20 worldwide citation)

Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coati ...


6
Richard A Schumacher: Backing plate for gate arrays or the like carries auxiliary components and provides probe access to electrical test points. Hewlett Packard Company, Edward L Miller, August 17, 1999: US05940278 (20 worldwide citation)

A VLSI IC's signals as they appear at the signal via pads on the back side of a mother board may be probed with the aid of a backing plate that is a piece of multi-layer printed circuit board material thick enough to be sufficiently stiff for the purpose. The multi-layer PCB backing plate has front ...


7
Richard A Schumacher, Ryan E Enge, Wayne D Larsen, Bryan S Moffitt, Julian Pharney: Communication connector having a printed circuit board with thin conductive layers. CommScope of North Carolina, Myers Bigel Sibley & Sajovec P A, December 23, 2014: US08915756 (15 worldwide citation)

Communications connectors include a housing and a printed circuit board that is at least partially mounted in the housing that has a plurality of conductive paths that are arranged in pairs to form a plurality of differential transmission lines. These connectors further include a plurality of contac ...


8
Richard A Schumacher, James R Day: Method and apparatus for delivering power using a multiplane power via matrix. Convex Computer Corporation, Winstead Sechrest & Minick, January 10, 1995: US05381306 (15 worldwide citation)

Disclosed is an apparatus and method for delivering power utilizing a multiplane power via matrix wherein the vias are each interconnected on each of the planes through which they pass such that a current flowing along any particular via, or via group, is free to either continue along its current pa ...


9
Richard A Schumacher: Connector between a daughterboard and a motherboard for high-speed single-ended electrical signals. Hewlett Packard Company, Cynthia S Baan, October 20, 1998: US05823795 (14 worldwide citation)

An assembly of two printed circuit boards (PCBs) mounted either perpendicular to or parallel to each other within a housing, each PCB bearing one or more low-profile high-density board-to-board commodity connectors providing equal numbers of electrical contacts. These commodity connectors mate to co ...


10
Richard A Schumacher, Amid I Hashim, Brian J Fitzpatrick, Bryan S Moffitt, Wayne D Larsen: Patch cord having a plug with differential transmission lines. CommScope of North Carolina, Myers Bigel Sibley & Sajovec P A, December 30, 2014: US08920199 (11 worldwide citation)

Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conducti ...