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Michael Sebald, Recai Sezi, Rainer Leuschner, Siegfried Birkle, Hellmut Ahne: Method for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after development. Siemens Aktiengesellschaft, Hill Steadman & Simpson, August 10, 1993: US05234793 (74 worldwide citation)

A photolithographic method for structure generation in bilayer processes is provided. Pursuant to the method, a dimensional reserve is produced in a top resist structure by chemical treatment with a bulging agent. The expansion preferably is performed by treatment with an aqueous solution. The expan ...


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Recai Sezi, Michael Sebald, Rainer Leuschner, Siegfried Birkle, Hellmut Ahne: Etch-resistant deep ultraviolet resist process having an aromatic treating step after development. Siemens Aktiengesellschaft, Hill Van Santen Steadman & Simpson, December 22, 1992: US05173393 (62 worldwide citation)

A photoresist system that is easily structurable and, in particular, is suitable for the deep ultraviolet range is provided. An increased etching resistance to a halogen-containing plasma is produced in a lithographically generated photoresist structure by treatment with a reactant. The reactant com ...


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Thorsten Meyer, Rainer Leuschner, Gerald Ofner, Reinhard Hess, Recai Sezi: Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads. Infineon Technologies, Slater & Matsil L, May 22, 2012: US08183696 (26 worldwide citation)

A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in m ...


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Recai Sezi, Thorsten Meyer: Semiconductor package and multichip arrangement having a polymer layer and an encapsulant. Infineon Technologies, Slater & Matsil L, September 4, 2012: US08258633 (20 worldwide citation)

A polymer layer is generated on a wafer. The wafer is then separated into semiconductor chips. At least two semiconductor chips are placed on a carrier with the polymer layer facing the carrier. The at least two semiconductor chips are covered with an encapsulating material to form an encapsulant. T ...


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Michael Sebald, Rainer Leuschner, Recai Sezi, Siegfried Birkle, Hellmut Ahne: Photostructuring method. Siemens Aktiengesellschaft, Hill Steadman & Simpson, August 10, 1993: US05234794 (17 worldwide citation)

A simple method for diminishing the trench width in a photoresist structure to below the resolution limit is provided. A photoresist structure is produced and treated with an agent then contains a bulging constituent that reacts with functional groups of the photoresist structure. The bulging consti ...


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Markus Brunnbauer, Jens Pohl, Klaus Pressel, Thorsten Meyer, Recai Sezi, Stephan Bradl, Ralf Plieninger: Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips. Infineon Technologies, Edell Shapiro & Finnan, March 30, 2010: US07687895 (14 worldwide citation)

A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also includes an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically cond ...


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Rainer Leuschner, Hellmut Ahne, Siegfried Birkle, Albert Hammerschmidt, Recai Sezi, Tobias Noll, Ann Dumoulin: Connection and build-up technique for multichip modules. Siemens Aktiengesellschaft, Kenyon & Kenyon, September 17, 1996: US05556812 (13 worldwide citation)

A method for manufacturing multichip modules having layer sequences made of dielectric material with conducting tracks embedded therein is characterized by the following features: (1) a temperature-resistant, base-resistant polymer having a dielectric constant .ltoreq.3 is used as a dielectric mater ...


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Recai Sezi, Hellmut Ahne, Eva Rissel, Kurt Geibel: Preparation of poly-o-hydroxyamides and poly o-mercaptoamides. Siemens Aktiengesellschaft, Kenyon & Kenyon, October 26, 1999: US05973202 (9 worldwide citation)

In a process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides, a bis-o-aminophenol or a bis-o-aminothiophenol is reacted with a dicarboxylic acid derivative of the following structure: ##STR1## with D=O, S, or NH and where R* is the parent body of the dicarboxylic acid and at le ...