1
Raymond S Enochs: Pressure interconnect package for integrated circuits. Tektronix, John D Winkelman, John Smith Hill, William O Geny, July 1, 1986: US04597617 (99 worldwide citation)

A pressure interconnect package for connecting an integrated circuit chip to an etched circuit board comprising a pressurized stack of circuit elements in which a flexible interconnecting circuit is disposed between the IC chip and the etched circuit board to cause them to make electrical contact up ...


2
Raymond S Enochs: Electro-optical transducer module and a method of fabricating such a module. Tektronix, John Smith Hill, Peter J Meza, March 5, 1991: US04997253 (28 worldwide citation)

An electro-optical transducer module comprises a substrate having a planar main surface, an electro-optical transducer adhered directly to the main surface of the substrate, and an optical fiber adhered directly to the main surface of the substrate. The optical fiber has an end face in optically cou ...


3
Ronald K Dodson, Raymond S Enochs, Randy S Randall: Electro-optical transducer module. Tektronix, William S Lovell, John D Winkelman, John Smith Hill, February 2, 1988: US04722586 (25 worldwide citation)

An electro-optical transducer module comprises a base member having a generally flat surface and a platform upstanding from the flat surface, an electro-optical transducer mounted on the platform, a fiber mount plate secured to the base member with one main face in confronting relationship with the ...


4
Morley M Blouke, Raymond S Enochs: Package for a charge-coupled device with temperature dependent cooling. Tektronix, John Smith Hill, John D Winkelman, William S Lovell, April 19, 1988: US04739382 (11 worldwide citation)

A charge-coupled device package comprises a substrate of dielectric material and a charge-coupled device die mounted on one main face of the substrate. The substrate is placed in heat exchange relationship with a cold sink, such as a bath of LN.sub.2. A temperature sensor senses the temperature at a ...


5
Raymond S Enochs, Randy S Randall: Temperature-compliant tube for fiber optic components. Tektronix, Francis I Gray, Peter J Meza, June 26, 1990: US04936646 (9 worldwide citation)

A temperature-compliant tube for fiber optic components is inserted into the exit port of an hermetically sealed package and extends into the interior of the package. An optical fiber extends through the temperature-compliant tube and is attached to a substrate interior of the package for coupling t ...