1
Raymond A Fillion, Robert J Wojnarowski, Michael Gdula, Herbert S Cole, Eric J Wildi, Wolfgang Daum: Method for fabricating an integrated circuit module. General Electric Company, Geoffrey H Krauss, October 11, 1994: US05353498 (693 worldwide citation)

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate ...


2
Raymond A Fillion, Robert J Woinarowski, Michael Gdula, Herbert S Cole, Eric J Wildi, Wolfgang Daum: Embedded substrate for integrated circuit modules. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, March 5, 1996: US05497033 (311 worldwide citation)

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate ...


3
Raymond A Fillion, Eric J Wildi, Charles S Korman, Sayed Amr El Hamamsy, Steven M Gasworth, Michael W DeVre, James F Burgess: Direct stacked and flip chip power semiconductor device structures. General Electric Company, Marvin Snyder, July 2, 1996: US05532512 (191 worldwide citation)

Power semiconductor device structures and assemblies with improved heat dissipation characteristics and low impedance interconnections include a thermally-conductive dielectric layer, such as diamondlike carbon (DLC) overlying at least portions of the active major surface of a semiconductor chip, wi ...


4
Herbert S Cole, Raymond A Fillion, Bernard Gorowitz, Ronald F Kolc, Robert J Wojnarowski: Fabrication and structures of circuit modules with flexible interconnect layers. Martin Marietta Corporation, Geoffrey H Krauss, June 18, 1996: US05527741 (187 worldwide citation)

A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having c ...


5
Raymond A Fillion, Otward M Mueller, James F Burgess: Wireless radio frequency power semiconductor devices using high density interconnect. General Electric Company, Ann M Agosti, Marvin Snyder, June 10, 1997: US05637922 (148 worldwide citation)

A power device component package includes a substrate supporting a drain lead, a source lead, and a gate lead. Each of the leads comprises an electrically conductive material having a thickness sufficient to form a high current contact. A power device component with component pads has an electricall ...


6
Raymond A Fillion, Robert J Wojnarowski: Integral power and ground structure for multi-chip modules. General Electric Company, Geoffrey H Krauss, October 4, 1994: US05353195 (105 worldwide citation)

A multi-chip module includes a substrate supporting a plurality of chips. A dielectric layer which overlies the chips and the substrate has a connection surface and a substrate surface with metallization planes having plane openings patterned on each surface and vias aligned with predetermined pads ...


7
Walter M Marcinkiewicz, Raymond A Fillion, Barry S Whitmore, Robert J Wojnarowski: Integrated circuit chip placement in a high density interconnect structure. Martin Marietta Corporation, Geoffrey H Krauss, June 6, 1995: US05422513 (96 worldwide citation)

A high density interconnect (HDI) structure having a dielectric multi-layer interconnect structure on a substrate is fabricated by forming a chip well, placing a chip in the well, and connecting the chip to the interconnect structure. Additionally, temperature sensitive chips or devices may be locat ...


8
Raymond A Fillion, William P Kornrumpf, Edward S Bernard: Hermetically packaged HDI electronic system. General Electric Company, Geoffrey H Krauss, May 24, 1994: US05315486 (90 worldwide citation)

A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner co ...


9
Raymond A Fillion, Herbert S Cole Jr: Reconstructable interconnect structure for electronic circuits. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, October 3, 1995: US05455459 (65 worldwide citation)

A reconstructible electrical circuit module includes a substrate, at least one electrical circuit component and an electrical interconnection structure. The electrical interconnection structure includes at least one multiple ply sequence stacked over the component and substrate in which the portion ...


10
Constantine A Neugebauer, Herbert S Cole, Eugene L Bartels, Raymond A Fillion: Moisture-proof electrical circuit high density interconnect module and method for making same. General Electric Company, Geoffrey H Krauss, Howard A Skaist, March 1, 1994: US05291066 (56 worldwide citation)

A moisture-proof integrated circuit module includes at least one integrated circuit component in a high density interconnect (HDI) structure fabricated by applying to a substrate successive multiple ply sequences having a plurality of via holes therein. The sequences overlie the component(s) and the ...