Madhav Datta, Ravindra Shenoy: Electroetching process for seed layer removal in electrochemical fabrication of wafers. IBM Corporation, Ratner & Prestia, January 23, 1996: US05486282 (36 worldwide citation)

A tool and process for electroetching metal films or layers on a substrate employs a linear electrode and a linear jet of electrolyte squirted from the electrode. The electrode is slowly scanned over the film by a drive mechanism. The current is preferably intermittent. In one embodiment a single wa ...

John M Cotte, Madhav Datta, Ravindra Shenoy: Lithium polymer electrolyte battery for sub-ambient temperature applications. International Business Machines Corporation, Domenica N S Hartman, Gary M Hartman, Casey P August, August 17, 1999: US05939223 (9 worldwide citation)

A primary lithium battery particularly adapted for use in self-contained self-powered devices (SSPD) for mobile communication and computing products, such as radio frequency identification tags, PCMCIA cards, and smart cards. The battery has a flexible and compact design, and utilizes a solid polyme ...

Chih Jen Hung, Ravindra Shenoy, Samuel W Sheng: Oscillator circuit with flicker noise suppression and method for operating the same. LSI Logic Corporation, Thelen Reid & Priest, June 15, 2004: US06750726 (9 worldwide citation)

An oscillator circuit includes an electrical load, a first metal oxide semiconductor (MOS) devise, a second MOS device, and a negative feedback circuit. The electrical load is coupled between a first node and a second node. The first MOS device is coupled between the first node and a third node, and ...

Donald William Kidwell Jr, Ravindra Shenoy, Mete Erturk, Layal Rouhana: Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate. QUALCOMM Incorporated, Loza & Loza, November 15, 2016: US09496213

An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a seco ...

Donald William Kidwell Jr, Ravindra Shenoy, Jon Lasiter: Sensor device. QUALCOMM Incorporated, Silicon Valley Patent Group, October 23, 2018: US10109784

Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PM ...

Ravindra Shenoy: Double-clamped delay stage and voltage controlled oscillator. LSI Logic Corporation, October 16, 2001: US06304150

A delay cell, a method for generating a delay, and a differential ring oscillator are disclosed. The delay cell provides a stable delay with a low voltage power supply, and has a high power supply rejection ratio. The delay cell generally comprises a first and second input receiver on a first and se ...