1
John F McMahon, Ravi Mahajan: Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces. Intel Corporation, Blakely Sokoloff Taylor & Zafman, September 8, 1998: US05804771 (54 worldwide citation)

A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bump ...


2
Ravi Prasher, Ravi Mahajan: Micro-channel heat exchangers and spreaders. Intel Corporation, Blakely Sokoloff Taylor & Zafman, August 23, 2005: US06934154 (41 worldwide citation)

Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is coupled to a thermal mass h ...


3
Ravi Prasher, Ravi Mahajan: Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink. Intel Corporation, Blakely Sokoloff Taylor & Zafman, June 7, 2005: US06903929 (38 worldwide citation)

Integrated circuit (IC) packages employing two-phase microchannel heat exchangers for cooling the packages' IC dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the I ...


4
Ravi Mahajan, Sandeep Sane: Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same. Intel Corporation, Kenneth A Nelson, November 22, 2011: US08064224 (36 worldwide citation)

A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive li ...


5
Oswald Skeete, Ravi Mahajan, John Guzek: Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate. Intel Corporation, Schwegman Lundberg & Woessner P A, April 10, 2018: US09941245 (31 worldwide citation)

In some embodiments, integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate are presented. In this regard, an apparatus is introduced having a first element including a microelectronic die having an active surface and at least one ...


6
George F Raiser, Bob Sundahl, Ravi Mahajan: Partial underfill for flip-chip electronic packages. Intel Corporation, Blakely Sokoloff Taylor & Zafman, March 2, 2004: US06700209 (15 worldwide citation)

An integrated circuit package that contains an underfill material between an integrated circuit and a substrate. The integrated circuit may be mounted to the substrate with solder bumps in a C4 process. The underfill material may extend from an edge of the integrated circuit a length that is no less ...


7
George F Raiser, Bob Sundahl, Ravi Mahajan: Partial underfill for flip-chip electronic packages. Intel Corporation, Blakely Sokoloff Taylor & Zafman, April 2, 2002: US06365441 (8 worldwide citation)

An integrated circuit package that contains an underfill material between an integrated circuit and a substrate. The integrated circuit may be mounted to the substrate with solder bumps in a C4 process. The underfill material may extend from an edge of the integrated circuit a length that is no less ...


8
Sarah E Kim, R Scott List, James G Maveety, Alan M Myers, Quat T Vu, Ravi Prasher, Ravi Mahajan, Gilroy Vandentop: Using external radiators with electroosmotic pumps for cooling integrated circuits. Intel Corporation, Trop Pruner & Hu P C, January 31, 2006: US06992381 (6 worldwide citation)

An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated ...


9
Ravi Mahajan, Sandeep Sane: Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same. Intel Corporation, Kenneth A Nelson, May 14, 2013: US08441809 (5 worldwide citation)

A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive li ...


10
Ioan Sauciuc, Ravi Mahajan: Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls. Intel Corporation, George Chen, May 26, 2009: US07539016 (4 worldwide citation)

The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cav ...