1
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders. Inernational Business Machines, Lawrence R Fraley, April 20, 1993: US05203075 (201 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


2
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders. International Business Machines Corporation, Lawrence R Fraley, November 16, 1993: US05261155 (113 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


3
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Flexible circuit member. International Business Machines Corporation, Lawrence R Fraley, July 25, 1995: US05435732 (44 worldwide citation)

A flexible circuit member including a circuitized substrate of a dielectric material having a plurality of apertures therein. Located within and/or bridging selected ones of the apertures are electrical conductors, the conductors having a solder member secured thereto. A frame is also used, the circ ...