1
Marion Francois, Pornin Jean Louis, Massit Claude, Caillat Patrice: Sealed cavity for electronic or electromagnetic component. Commissariat Energie Atomique, December 24, 1999: FR2780200-A1 (31 worldwide citation)

The system uses two rings of material - one to seal and one to adhere components.- DETAILED DESCRIPTION - The device comprises a support plate (100) and at least one cover (104) capable of being sealed to the support to form with it a cavity (114). This provides a controlled atmosphere around a comp ...


2
Boitel Michelle, Marion Francois, Pornin Jean Louis, Ravetto Michel: Method and apparatus for interconnecting electrical components by solder elements.. Commissariat Energie Atomique, November 2, 1990: FR2646558-A1 (8 worldwide citation)

The components (20, 24) are provided with electrical contact pads and, given two components to be interconnected, the pads of one of them are covered with solder elements (28), made of a metallic material with low melting point, which can be soldered to the pads, the latter being wetted by the mater ...


3
CAPLET STEPHANE, BAILLIN XAVIER, PORNIN JEAN LOUIS: [fr] Procédé dencapsulation dun dispositif microélectronique par un materiau getter, [de] Einkapselungsverfahren einer mikroelektronischen Vorrichtung mit Hilfe eines Getter-Materials, [en] Method for encapsulating a microelectronic device with a getter material. COMMISSARIAT ENERGIE ATOMIQUE, January 6, 2010: EP2141117-A1 (7 worldwide citation)

[en] The method involves forming a portion of sacrificial material covering a portion of microelectronic device (100), where a volume of the device occupies a space to form a part of a cavity (114). A getter material layer (108) is deposited, and a part of the portion of material is covered. An orif ...


4
Marion Francois, Pornin Jean Louis, Imperinetti Pierre: Three dimensional electronic components assembly method by means of microwire loops and solder elements.. Commissariat Energie Atomique, March 8, 1995: EP0642163-A1 (7 worldwide citation)

According to the invention, in order to assemble at least one first electronic component (1) equipped with at least one first electrical contact region (5) and at least one second electronic component (10) equipped with at least one second electrical contact region (13), a loop of conducting mircowi ...


5
Pornin Jean Louis, Gillot Charlotte, Baleras Francois: Encapsulated microcomponent equipped with at least one getter. Commissariat Energie Atomique, January 16, 2008: EP1878693-A1 (5 worldwide citation)

The microcomponent has a cover (3) delimiting a sealed cavity (4), and equipped of an orifice (5) that is provided with a stopper (6). The stopper includes a portion made of a getter material e.g. titanium, exposed inside the sealed cavity. A sealing portion of the stopper is surmounted in the gette ...


6
Brun Jean, Baleras Francois, Pornin Jean Louis, Mathieu Lydie, Bonvalot Dubois Beatrice, Roumegoux Julien, Depoutot Frederic: Microcomposant comportant deux plaquettes interconnectees par des picots et procede dinterconnexion associe. Commissariat Energie Atomique, Axalto, June 29, 2007: FR2895567-A1 (4 worldwide citation)

Le microcomposant (1) comporte une première plaquette (2), munie d'une pluralité de picots de connexion électrique (5), une seconde plaquette (7), munie d'une pluralité de plots de connexion électrique (8), destinés à coopérer avec les picots de connexion électrique (5) de la première plaquette (2). ...


7
Boitel Michelle, Marion Francois, Pornin Jean Louis, Ravetto Michel: Method and apparatus for interconnecting electrical components by solder elements.. Commissariat Energie Atomique, October 31, 1990: EP0395488-A1 (3 worldwide citation)

The components (20, 24) are provided with electrical contact pads and, given two components to be interconnected, the pads of one of them are covered with solder elements (28), made of a metallic material with low melting point, which can be soldered to the pads, the latter being wetted by the mater ...


8
PORNIN JEAN LOUIS, GILLOT CHARLOTTE: PROCEDE DENCAPSULATION DUN MICROCOMPOSANT PAR UN CAPOT RENFORCE MECANIQUEMENT. COMMISSARIAT ENERGIE ATOMIQUE, August 5, 2011: FR2955999-A1 (2 worldwide citation)

Procédé d'encapsulation d'un microcomposant (100) disposé sur et/ou dans un substrat (102), comportant les étapes de : - dépôt d'un matériau sacrificiel recouvrant le microcomposant, - réalisation d'un capot (104) recouvrant le matériau sacrificiel, - suppression du matériau sacrificiel via une ouve ...


9
PORNIN JEAN LOUIS, DUMONT GEOFFROY: [fr] STRUCTURE DENCAPSULATION DE DISPOSITIF ELECTRONIQUE ET PROCEDE DE REALISATION DUNE TELLE STRUCTURE. COMMISSARIAT ENERGIE ATOMIQUE, April 12, 2013: FR2981198-A1 (1 worldwide citation)

[fr] Structure d'encapsulation (100) d'au moins un dispositif électronique (102), comportant au moins une première cavité (106) délimitée par un support (104) et au moins un capot (108) disposé sur le support et dans laquelle est encapsulé le dispositif électronique, le capot étant traversé par au m ...


10
Pornin Jean Louis, Gillot Charlotte, Baleras Francois: Encapsulated microcomponent equipped with at least one getter. Commissariat Energie Atomique, January 18, 2008: FR2903678-A1 (1 worldwide citation)

The microcomponent has a cover (3) delimiting a sealed cavity (4), and equipped of an orifice (5) that is provided with a stopper (6). The stopper includes a portion made of a getter material e.g. titanium, exposed inside the sealed cavity. A sealing portion of the stopper is surmounted in the gette ...



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