1
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia: Active chip on carrier or laminated chip having microelectronic element embedded therein. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 3, 2013: US08598695 (24 worldwide citation)

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connec ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Piyush Savalia: Multi-chip module with stacked face-down connected dies. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 23, 2014: US08841765 (20 worldwide citation)

A microelectronic assembly can include a substrate having first and second surfaces, at least two logic chips overlying the first surface, and a memory chip having a front surface with contacts thereon, the front surface of the memory chip confronting a rear surface of each logic chip. The substrate ...


3
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia: Microelectronic elements with post-assembly planarization. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08847376 (19 worldwide citation)

A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microele ...


4
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia: Microelectronic elements having metallic pads overlying vias. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 29, 2014: US08791575 (18 worldwide citation)

A microelectronic unit, an interconnection substrate, and a method of fabricating a microelectronic unit are disclosed. A microelectronic unit can include a semiconductor element having a plurality of active semiconductor devices therein, the semiconductor element having a first opening extending fr ...


5
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell: Simultaneous wafer bonding and interconnect joining. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 16, 2013: US08486758 (7 worldwide citation)

Disclosed are a microelectronic assembly of two elements and a method of forming same. A microelectronic element includes a major surface, and a dielectric layer and at least one bond pad exposed at the major surface. The microelectronic element may contain a plurality of active circuit elements. A ...


6
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Multi-function and shielded 3D interconnects. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2013: US08610259 (5 worldwide citation)

A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening ext ...


7
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Stacked microelectronic assemby with TSVS formed in stages and carrier above chip. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 27, 2014: US08736066 (5 worldwide citation)

A microelectronic assembly is provided which includes a first element consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface facing and attached to a major surface of a microelectronic element at which a plurality of conductive pads are exposed, the ...


8
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Chip assembly having via interconnects joined by plating. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 1, 2014: US08685793 (4 worldwide citation)

An assembly and method of making same are provided. The assembly can be formed by juxtaposing a first electrically conductive element overlying a major surface of a first semiconductor element with an electrically conductive pad exposed at a front surface of a second semiconductor element. An openin ...


9
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Stacked microelectronic assembly with TSVs formed in stages with plural active chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 19, 2013: US08587126 (3 worldwide citation)

A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive ...


10
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Non-lithographic formation of three-dimensional conductive elements. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 15, 2014: US08697569 (3 worldwide citation)

A method of forming a conductive element on a substrate and the resulting assembly are provided. The method includes forming a groove in a sacrificial layer overlying a dielectric region disposed on a substrate. The groove preferably extends along a sloped surface of the substrate. The sacrificial l ...