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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 31, 2013: US08618659 (70 worldwide citation)

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first ...


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Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R Osborn: Microelectronic packages having cavities for receiving microelectric elements. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 9, 2011: US07994622 (14 worldwide citation)

Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera Research, Lerner David Littenberg Krumholz & Mentlik, August 30, 2011: US08008785 (3 worldwide citation)

A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive b ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 2, 2013: US08410618 (2 worldwide citation)

A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive b ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Jae M Park, Belgacem Haba, Fion Tan, Philip R Osborn: Microelectronic connection components having bondable wires. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2007: US07268304 (2 worldwide citation)

A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be f ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 26, 2014: US08816514

First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip co ...


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Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R Osborn: Microelectronic packages having cavities for receiving microelectronic elements. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 24, 2013: US08541873

Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.


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Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R Osborn: Semiconductor chip packages having cavities. Tessera, Tessera, LERNER DAVID et al, December 11, 2008: US20080303132-A1

Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera Research, June 23, 2011: US20110147953-A1

A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive b ...


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Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R Osborn: Microelectronic packages having cavities for receiving microelectronic elements. Tessera, December 1, 2011: US20110291297-A1

Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.