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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 12, 2006: US07149095 (41 worldwide citation)

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the ...


2
Belgacem Haba Belgacem (Bel) Haba
Philip Damberg, Belgacem Haba, David B Tuckerman, Teck Gyu Kang: Micro pin grid array with pin motion isolation. Tessera, LErner David Littenberg Krumholz & Mentlik, May 4, 2010: US07709968 (36 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are ele ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera Research, Lerner David Littenberg Krumholz & Mentlik, August 30, 2011: US08008785 (3 worldwide citation)

A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive b ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 2, 2013: US08410618 (2 worldwide citation)

A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive b ...


5
Belgacem Haba Belgacem (Bel) Haba
Philip Damberg, Belgacem Haba, David B Tuckerman, Teck Gyu Kang: Micro pin grid array with pin motion isolation. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 10, 2013: US08531039 (1 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are ele ...


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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Chip with sintered connections to package. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 3, 2013: US08525338 (1 worldwide citation)

A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge su ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Methods of making microelectronic assemblies including folded substrates. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2003: US20030168725-A1 (1 worldwide citation)

A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 26, 2014: US08816514

First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip co ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera Research, June 23, 2011: US20110147953-A1

A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive b ...


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Belgacem Haba Belgacem (Bel) Haba
Kimitaka Endo, Philip Damberg, Craig S Mitchell, Sean Moran, Christopher Wade, Belgacem Haba, John Riley: Multilayer substrate with interconnection vias and method of manufacturing the same. Tessera, Tessera, LERNER DAVID et al, March 19, 2009: US20090071707-A1

A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole ...