1
Charles Szmanda
Charles R Szmanda, George G Barclay, Peter Trefonas III, Wang Yueh: Polymer and photoresist compositions. Shipley Company L L C, S Matthew Cairns, June 18, 2002: US06406828 (19 worldwide citation)

Disclosed are polymers including as polymerized units one or more spirocyclic olefin monomer of the formulae I or Ia


2
Ed Rutter
Edward W Rutter Jr, Peter Trefonas III, Edward K Pavelchek: Aperture fill. Shipley Company L L C, S Matthew Cairns, October 8, 2002: US06461717 (13 worldwide citation)

Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.


3
Charles Szmanda
Peter Trefonas III, Charles R Szmanda, Gerald C Vizvary: Radiation sensitive composition containing novel dye. Shipley Company L L C, Darryl P Frickey, S Matthew Cairns, Peter F Corless, August 29, 2000: US06110641 (8 worldwide citation)

A photoresist composition comprising an alkali soluble resin, a photoacid generating compound that undergoes photolysis when exposed to a pattern of activating irradiation within a wavelength of from 330 to 700 .mu.m, a crosslinking agent capable of crosslinking the composition when activated by pho ...


4
Charles Szmanda
Charles R Szmanda, Peter Trefonas III: Negative photoresist composition. Shipley Company L L C, Robert L Goldberg, Peter F Corless, Darryl P Frickey, February 2, 1999: US05866299 (6 worldwide citation)

A photoresist composition and process that minimizes the effect of photogenerated acid migration. The photoresist comprises an alkali soluble resin, a photoacid generating compound that undergoes photolysis within a wavelength of from 330 to 700 nm to yield a strong acid, a crosslinking agent capabl ...


5
Charles Szmanda
Charles R Szmanda, George G Barclay, Peter Trefonas III, Wang Yueh: Polymer and photoresist compositions. Shipley Company L L C, S Matthew Cairns, July 29, 2003: US06599677 (6 worldwide citation)

Disclosed are spirocyclic olefin ploymers, methods of preparing spirocyclic olefin polymers, photoresist compositions including spirocyclic olefin resin binders and methods of forming relief images using such photoresist compositions.


6
Charles Szmanda
Charles R Szmanda, Peter Trefonas III, Richard C Hemond, Mark S Thirsk, Leo L Linehan, Anthony Zampini: Method and system for recycling materials. Shipley Company L L C, Marisa J Dubuc, S Matthew Cairns, June 14, 2005: US06907432 (2 worldwide citation)

A system and method is provided for recycling raw materials from a plurality waste streams generated by waste stream providers and includes a waste stream monitoring module for monitoring the plurality of waste streams and determining an amount of reusable raw materials contained in each of the plur ...


7
Charles Szmanda
Charles R Szmanda, George G Barclay, Peter Trefonas III, Wang Yueh: Polymer and photoresist compositions. Shipley Company, S Matthew Cairns, October 10, 2006: US07118847

Disclosed are spirocyclic olefin polymers, methods of preparing spirocyclic olefin polymers, photresist compositions including spirocyclic olefin resin binders and methods of forming relief images using such photoresist compositions.


8
Charles Szmanda
Peter Trefonas III, Gary N Taylor, Charles R Szmanda: Polymers and photoresist compositions for short wavelength imaging. Shipley Company L L C, Peter F Corless, Darryl P Frickey, Edwards Angell Palmer Dodge, April 10, 2007: US07202009

This invention relates to resins and photoresist compositions that comprise such resins. Preferred polymers of the invention comprise adjacent saturated carbon atoms, either integral or pendant to the polymer backbone, that have a substantially gauche conformation. Polymers of the invention are part ...


9
Young Bae
Young Cheol BAE, Yi Liu, Thomas Cardolaccia, Peter Trefonas III: Compositions and methods for multiple exposure photolithography. Rohm and Haas Electronic Materials, Jonathan D Baskin, Rohm and Haas Electronic Materials, November 25, 2010: US20100297851-A1

Compositions for use in multiple exposure photolithography and methods of forming electronic devices using a multiple exposure lithographic process are provided. The compositions find particular applicability in semiconductor device manufacture for making high-density lithographic patterns.


10
Maricela Morales
Timothy Adams, Edward Pavelchek, Roger Sinta, Manuel Docanto, Robert Blacksmith, Peter Trefonas Iii: Antireflective coating compositions. Peter F Corless, August 1, 2002: US20020102483-A1

The invention provides new light absorbing crosslinking compositions suitable for use as an antireflective composition (ARC), particularly suitable for short wavelength imaging applications such as 193 nm. The ARCs of the invention are preferably used with an overcoated resist layer (i.e. bottom lay ...