1
Michael Bauer, Peter Strobel, Gerald Ofner, Edward Fürgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig Czaja PLLC, September 2, 2008: US07420262 (20 worldwide citation)

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


2
Henrik Wist, Alf Ritter, Mario Zeiss, Hanna Rotermund Buwen, Helmar Werner Lang, Jörg Peter Strobel, Klaus Peter Kreuzer: Method for assigning digital image information to the navigational data of a medical navigation system. BrainLAB, Renner Otto Boisselle & Sklar, September 8, 2009: US07587235 (20 worldwide citation)

A method for assigning digital image information to the navigational data of a medical navigation system is provided. The method includes: producing digital image information from a digital image recording device for a patient being monitored by means of the navigation system; transmitting a signal ...


3
Edward Fuergut, Bernd Goller, Robert Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner: Smart card, smart card module, and a method for production of a smart card module. Infineon Technologies, Edell Shapiro & Finnan, August 18, 2009: US07575173 (17 worldwide citation)

A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surfa ...


4
Jens Pohl, Edward Fuergut, Markus Brunnbauer, Thorsten Meyer, Peter Strobel, Daniel Porwol, Ulrich Wachter: Reconfigured wafer alignment. Infineon Technologies, Dicke Billig & Czaja PLLC, May 17, 2011: US07943423 (13 worldwide citation)

A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main ...


5
Michael Bauer, Wolfram Eurskens, Gerold Gruendler, Rudolf Kerler, Heinz Pape, Peter Strobel: Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof. Infineon Technologies, Edell Shapiro & Finnan, October 2, 2007: US07276785 (10 worldwide citation)

The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bondin ...


6
Peter Strobel, Heinz Suhner, Lothar Knuenz: Zero-degree assistants device for a microscope. Leica Microsystems, Hodgson Russ, May 27, 2008: US07379239 (4 worldwide citation)

A zero-degree assistant's device for a microscope has a tube carrier (2) for the principal observer's tube, an interface (5) for the microscope body, an assistant's module (6), pivotable about an axis (4), having an interface (7) for an assistant's tube, and having a retaining device (8, 12) for rel ...


7
Harald Schnitzler, Peter Strobel, James Ng, Manfred Kuster: Stereo microscope with beam splitter device. Leica Instruments, Foley & Lardner, April 10, 2012: US08154795 (2 worldwide citation)

The present invention relates to a stereo microscope (20) with a first and a second main beam path (21, 22), the spacing of which defines a stereo base (23), wherein an axis of the microscope (24) extends through the middle of the stereo base (23) parallel to the main beam paths (21, 22), and with a ...


8
Peter Strobel, Fritz Sollberger: Microscope with a handle and/or hand-grip for a microscope. Leica Microsystems, Foley & Lardner, November 14, 2006: US07136221 (2 worldwide citation)

The invention relates to a hand-grip with a grip part which can be detachably fastened on a microscope housing, the mounting and dismounting being possible with a single-handed movement with the gripping hand. The hand-grip is fashioned and positioned such that it permits operation of the microscope ...


9
Michael Bauer, Ludwig Heitzer, Eric Kuerzel, Peter Strobel: Semiconductor device with semiconductor chip and adhesive film and method for producing the same. Infineon Technologies, Edell Shapiro & Finnan, December 30, 2008: US07470601 (2 worldwide citation)

A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard m ...


10
Edward Fuergut, Bernd Goller, Robert Christian Hagen, Simon Jerebic, Jens Pohl, Holger Woerner, Peter Strobel: Electronic module having plug contacts and method for producing it. Infineon Technologies, Dicke Billig Czaja PLLC, June 24, 2008: US07391103 (1 worldwide citation)

The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being ar ...



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