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Emmet Joseph Howard Peter Andrews: Surgical forceps. Birch Stewart Kolasch & Birch, December 26, 2006: US07153321 (60 worldwide citation)

A surgical forceps has blades of arcuate shape and handles which are urged apart by springs on a guide blade which mounts the blades by a pivot joint. The guide blade projects below the blades. Gripping means formed by bifurcated arms on the guide blade will, when moved apart, grip an intercostal dr ...


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Peter Andrews, Thomas G Coleman, James Ibbetson, Michael Leung, Gerald H Negley, Eric Tarsa: Methods for packaging of a semiconductor light emitting device. Cree, Myers Bigel Sibley & Sajovec, February 5, 2008: US07326583 (50 worldwide citation)

Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting ...


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Uta Jensen Korte, Reinhold Gehring, Otto Schallner, Jorg Stetter, Heinz Jurgen Wroblowsky, Benedikt Becker, Bernhard Homeyer, Wolfgang Behrenz, Wilhelm Stendel, Peter Andrews: 1-aryl-4-alkylthiopyrazol-5-amine derivatives, composition containing them, and method of using them to combat insects, arachnids, and nematodes. Bayer Aktiengesellschaft, Sprung Horn Kramer & Woods, February 14, 1989: US04804675 (48 worldwide citation)

A method of combating insects, sense animals and nematodes comprising applying to insects, arachnids and nematodes and/or their environment an effective amount of at least one 5-aminopyrazole of the formula (I) ##STR1## in which R.sup.1 represents hydrogen, alkyl or halogenoalkyl,


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Michael T Bruhns, Brad Williams, Jeff LaHaye, Peter Andrews: Trench cut light emitting diodes and methods of fabricating same. Cree, Myers Bigel Sibley & Sajovec P A, May 6, 2008: US07368756 (44 worldwide citation)

A method is provided for forming semiconductor devices using a semiconductor substrate having first and second opposed sides, and at least one device layer on the second side of the substrate, the at least one device layer including first and second device portions. A first trench is formed in the f ...


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Ban P Loh, Nicholas W Medendorp Jr, Peter Andrews, Yankun Fu, Michael Laughner, Ronan Letoquin: Method of uniform phosphor chip coating and LED package fabricated using method. Cree, Koppel Patrick Heybl & Philpott, May 17, 2011: US07943952 (40 worldwide citation)

Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are al ...


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Bernd Keller, James Ibbetson, Peter Andrews, Gerald H Negley, Norbert Hiller: Semiconductor light emitting devices and submounts. Cree, Myers Bigel Sibley & Sajovec, April 14, 2009: US07518158 (38 worldwide citation)

A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad ...


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Peter Andrews: Organ preservative solution. Georgetown University, Oblon Spivak McClelland Maier & Neustadt, April 26, 1994: US05306711 (36 worldwide citation)

An organ preservative solution containing a low molecular weight dextran in a pharmacologically acceptable storage solution is suitable for storage and preservative of organs for transplantation.


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Peter Andrews: Packages for semiconductor light emitting devices utilizing dispensed encapsulants. Cree, Myers Bigel Sibley & Sajovec, April 29, 2008: US07365371 (35 worldwide citation)

A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the subs ...


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Michael T Bruhns, Brad Williams, Jeff LaHaye, Peter Andrews: Trench cut light emitting diodes and methods of fabricating same. Cree, Myers Bigel Sibley & Sajovec P A, February 7, 2006: US06995032 (35 worldwide citation)

A method is provided for forming semiconductor devices using a semiconductor substrate having first and second opposed sides, and at least one device layer on the second side of the substrate, the at least one device layer including first and second device portions. A first trench is formed in the f ...