1
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Edward Yang, Kun Lin Wu, Fu Yang Yu: Chemical-mechanical polishing pad. United Microelectronics, September 19, 2000: US06120366 (34 worldwide citation)

The invention provides a chemical-mechanical polishing pad, which includes a plurality of annular grooves and a plurality of streamline grooves designed according to principles of the hydrodynamics. The streamline grooves of polishing pad are designed according to flow equations derived from source ...


2
Daniel Chiu, C C Yang, Peng Yih Peng, J Y Wu, J S Lai: Retainer ring for polishing head of chemical-mechanical polish machines. United Microelectronics, Finnegan Henderson Farabow Garrett & Dunner L, August 31, 1999: US05944593 (28 worldwide citation)

A retainer ring is provided for used on the polishing head of a CMP machine, which can allow the slurry being applied to the CMP process to be uniformly distributed over the surface of the wafer. The retainer ring is designed for use on a CMP machine of the type having a polishing table, a polishing ...


3
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Kun Lin Wu, Daniel Chiu, Chih Chiang Yang, Juan Yuan Wu, Hao Kuang Chiu: Chemical-mechanical polish machines and fabrication process using the same. United Microelectronics, Thomas Kayden Horstemeyer & Risley, September 25, 2001: US06293850 (15 worldwide citation)

A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurr ...


4
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Kun Lin Wu, Daniel Chiu, Chih Chiang Yang, Juan Yuan Wu, Hao Kuang Chiu: Chemical-mechanical polish machines and fabrication process using the same. United Microelectronics, Thomas Kayden Horstemeyer & Risley, February 6, 2001: US06183350 (10 worldwide citation)

A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurr ...


5
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Chia Jui Chang: Wafer polishing head. United Microelectronics, Oblon Spivak McClelland Maier & Neustadt P C, April 24, 2001: US06220930 (10 worldwide citation)

A wafer polishing head for planarizing a wafer. The wafer polishing head comprises a carrier, a retaining ring, a first pressure chamber, a second pressure chamber and an automatic control system. The retaining ring is surrounding the carrier. The first pressure chamber having a first inner pressure ...


6
Chao Yuan Huang, Peng Yih Peng, Juan Yuan Wu: Circulation system of slurry. United Microelectronics, Thomas Kayden Horstemeyer & Risley, November 30, 1999: US05993647 (9 worldwide citation)

A slurry filtration system for supplying a slurry to a polisher to perform a chemical mechanical polishing process. The system comprises a first three-way valve, to receive the slurry supplied from an external system; a slurry pump, to control the slurry flowing from the first three-way valve, and t ...


7
Hao Kuang Chiu, Peng Yih Peng: Filtering apparatus with stirrer in a CMP apparatus. United Microelectronics, Jiawei Huang, J C Patents, August 22, 2000: US06106714 (7 worldwide citation)

A chemical-mechanical polishing (CMP) apparatus includes a filtering apparatus for filtering slurry. The filtering apparatus includes an input aperture located at the top of the filter housing and connected to a slurry supplying machine. An output aperture located at the side of the filter housing i ...


8
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Hao Kuang Chiu, Kun Lin Wu: Retainer ring design for polishing head of chemical-mechanical polishing machine. United Microelectronics, Christie Parker & Hale, May 16, 2000: US06062963 (5 worldwide citation)

A chemical-mechanical polishing machine having an improved wafer retainer ring design for the polishing head, comprising a polishing table, a polishing pad, a polishing head and a wafer retainer ring, wherein the polishing pad is above the polishing table, the polishing head is above the polishing p ...


9
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Chia Jui Chang: Chemical mechanical polishing machine. United Microelectronics, Hickman Stephens Coleman & Hughes, August 1, 2000: US06096162 (3 worldwide citation)

A CMP machine includes several polishing tables mounted on a carousel, which rotates in one direction. Each of the polishing tables includes a polishing pad. Each polishing pad can polish one wafer on its first surface. Each polishing pad also has one distributing duct used to supply slurry onto the ...


10
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Kun Lin Wu, Daniel Chiu, Chih Chiang Yang, Juan Yuan Wu, Hao Kuang Chiu: Chemical mechanical polish machines and fabrication process using the same. United Microelectronics, Thomas Kayden Horstemeyer & Risley, June 5, 2001: US06241582 (2 worldwide citation)

A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurr ...