1
Pekka J Soininen, Kai Erik Elers, Suvi Haukka: Method of growing electrical conductors by reducing metal oxide film with organic compound containing -OH, -CHO, or -COOH. ASM Microchemistry Oy, Knobbe Martens Olson & Bear, November 19, 2002: US06482740 (293 worldwide citation)

This invention relates to manufacturing of integrated circuits (ICs) and especially conductive layers suitable for use in an IC. According to the preferred method a metal oxide thin film is deposited on a substrate surface and reduced thereafter essentially into a metallic form with an organic reduc ...


2
Ivo Raaijmakers, Suvi P Haukka, Ville A Saanila, Pekka J Soininen, Kai Erik Elers, Ernst H A Granneman: Method of making conformal lining layers for damascene metallization. ASM International, Knobbe Martens Olson & Bear, April 27, 2004: US06727169 (102 worldwide citation)

Method and structures are provided for conformal lining of dual damascene structures in integrated circuits. Trenches and contact vias are formed in insulating layers. The trenches and vias are exposed to alternating chemistries to form monolayers of a desired lining material. Exemplary process flow ...


3
Auguste J L Sophie, Hessel Sprey, Pekka J Soininen, Kai Erik Elers: In situ reduction of copper oxide prior to silicon carbide deposition. ASM International, Knobbe Martens Olson & Bear, April 12, 2005: US06878628 (58 worldwide citation)

The invention relates generally to improved silicon carbide deposition during dual damascene processing. In one aspect of the invention, copper oxide present on a substrate is reduced at least partially to copper prior to deposition of a silicon carbide or silicon oxycarbide layer thereon. In the pr ...


4
Pekka J Soininen, Kai Erik Elers, Suvi Haukka: Method of growing electrical conductors. ASM International, Knobbe Martens Olson & Bear, May 3, 2005: US06887795 (55 worldwide citation)

This invention relates to manufacturing of integrated circuits (ICs) and especially conductive layers suitable for use in an IC. According to the preferred method a metal oxide thin film is deposited on a substrate surface and reduced thereafter essentially into a metallic form with an organic reduc ...


5
Ki Bum Kim, Pekka J Soininen, Ivo Raaijmakers: Copper interconnect structure having stuffed diffusion barrier. ASM International, Knobbe Martens Olson & Bear, August 30, 2005: US06936535 (48 worldwide citation)

The present invention provides a method of fabricating a semiconductor device, which could advance the commercialization of semiconductor devices with a copper interconnect. In a process of metal interconnect line fabrication, a TiN thin film combined with an Al intermediate layer is used as a diffu ...


6
Pekka J Soininen, Kai Erik Elers, Ernst H A Granneman: Metal anneal with oxidation prevention. ASM Intenational, Knobbe Martens Olson & Bear, January 20, 2004: US06679951 (39 worldwide citation)

The invention relates generally to the prevention of copper oxidation during copper anneal processes. In one aspect of the invention, copper oxidation is prevented by carrying out the anneal in the presence of one or more organic reducing agents.


7
Juhana Kostamo, Pekka J Soininen, Kai Erik Elers, Suvi Haukka: Method of growing electrical conductors. ASM International, Knobbe Martens Olson & Bear, February 24, 2009: US07494927 (37 worldwide citation)

A method for forming a conductive thin film includes depositing a metal oxide thin film on a substrate by an atomic layer deposition (ALD) process. The method further includes at least partially reducing the metal oxide thin film by exposing the metal oxide thin film to a reducing agent, thereby for ...


8
Juhana Kostamo, Pekka J Soininen, Kai Erik Elers, Suvi Haukka: Method of growing electrical conductors. ASM International, Knobbe Martens Olson & Bear, June 7, 2011: US07955979 (15 worldwide citation)

A method for forming a conductive thin film includes depositing a metal oxide thin film on a substrate by an atomic layer deposition (ALD) process. The method further includes at least partially reducing the metal oxide thin film by exposing the metal oxide thin film to a reducing agent, thereby for ...


9
Juhana Kostamo, Pekka J Soininen, Kai Erik Elers, Suvi Haukka: Method of growing electrical conductors. ASM International, Knobbe Martens Olson & Bear, September 17, 2013: US08536058 (13 worldwide citation)

A method for forming a conductive thin film includes depositing a metal oxide thin film on a substrate by an atomic layer deposition (ALD) process. The method further includes at least partially reducing the metal oxide thin film by exposing the metal oxide thin film to a reducing agent, thereby for ...


10
Ivo Raaijmakers, Suvi P Haukka, Yille A Saanila, Pekka J Soininen, Kai Erik Elers, Ernst H A Granneman: Conformal lining layers for damascene metallization. ASM International, Knobbe Martens Olson & Bear, September 5, 2006: US07102235 (9 worldwide citation)

Method and structures are provided for conformal lining of dual damascene structures in integrated circuits. Trenches and contact vias are formed in insulating layers. The trenches and vias are exposed to alternating chemistries to form monolayers of a desired lining material. Exemplary process flow ...