1
Paul Janis Timans: System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy. Mattson Technology, Dority & Manning P A, March 21, 2006: US07015422 (43 worldwide citation)

Various processes for heating semiconductor wafers is disclosed. In particular, the present invention is directed to configuring light sources emitting light energy onto a wafer in order to optimize absorption of the energy by the wafer. Optimization is carried out by varying the angle of incidence ...


2
Arnon Gat, Bob Bogart, Conor Patrick O&apos Carroll, Paul Janis Timans, Shuen Chun Choy, Zion Koren, Chris Francis Bragg: Heating device for heating semiconductor wafers in thermal processing chambers. Mattson Technology, Dority & Manning P A, April 6, 2004: US06717158 (31 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. In accordance with the present invent ...


3
Paul Janis Timans: Apparatus and method for reducing stray light in substrate processing chambers. Mattson Technology, Dority & Manning P A, December 28, 2004: US06835914 (26 worldwide citation)

A method and apparatus for heating semiconductor wafers in thermal processing chambers. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the wafer during processing. The radiation sensing ...


4
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Dority & Manning P A, November 29, 2005: US06970644 (25 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


5
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Dority & Manning P A, September 11, 2007: US07269343 (17 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


6
Paul Janis Timans: Apparatus and method for reducing stray light in substrate processing chambers. Mattson Technology, Dority & Manning P A, November 14, 2006: US07135656 (17 worldwide citation)

A method and apparatus for heating semiconductor wafers in thermal processing chambers. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the wafer during processing. The radiation sensing ...


7
Paul Janis Timans: System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy. Mattson Technology, Dority & Manning P A, November 18, 2008: US07453051 (13 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


8
Paul Janis Timans: Methods for determining wafer temperature. Mattson Technology, Dority & Manning P A, June 9, 2009: US07543981 (11 worldwide citation)

Methods and apparatus for wafer temperature measurement and calibration of temperature measurement devices may be based on determining the absorption of a layer in a semiconductor wafer. The absorption may be determined by directing light towards the wafer and measuring light reflected from the wafe ...


9
Paul Janis Timans: Apparatus and method for reducing stray light in substrate processing chambers. Mattson Technology, Dority & Manning P A, April 15, 2008: US07358462 (9 worldwide citation)

A method and apparatus for heating semiconductor wafers in thermal processing chambers is disclosed. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the wafer during processing. The radia ...


10
Paul Janis Timans: System and process for calibrating pyrometers in thermal processing chambers. Mattson Technology, Dority & Manning P A, June 8, 2010: US07734439 (9 worldwide citation)

A method and system for calibrating temperature measurement devices, such as pyrometers, in thermal processing chambers are disclosed. According to the present invention, the system includes a calibrating light source that emits light energy onto a substrate contained in the thermal processing chamb ...