1
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof. International Business Machines Corporation, Daniel P Morris, October 13, 1998: US05821763 (235 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compli ...


2
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yaun Shih: High density cantilevered probe for electronic devices. International Business Machines Corporation, Daniel P Morris, September 22, 1998: US05811982 (199 worldwide citation)

Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which exte ...


3
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: High density integrated circuit apparatus, test probe and methods of use thereof. International Business Machines Corporation, Daniel P Morris, January 1, 2002: US06334247 (170 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compli ...


4
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice H Norcott, Da Yuan Shih, George Frederick Walker: Method of making high density integral test probe. International Business Machines Corporation, Daniel P Morris, December 25, 2001: US06332270 (164 worldwide citation)

A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having ...


5
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da Yuan Shih: Angled flying lead wire bonding process. International Business Machines Corporation, Daniel P Morris, October 2, 2001: US06295729 (151 worldwide citation)

A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond ...


6
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: High density integrated circuit apparatus, test probe and methods of use thereof. International Business Machines Corporation, Daniel P Morris, October 9, 2001: US06300780 (149 worldwide citation)

A high density test probe for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packagi ...


7
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da Yuan Shih: Structures and processes to create a desired probetip contact geometry on a wafer test probe. International Business Machines Corporation, Daniel P Morris, March 27, 2001: US06206273 (144 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are formed by cutting wit ...


8
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da Yuan Shih: Angled flying lead wire bonding process. International Business Machines Corporation, Daniel P Morris, March 23, 2004: US06708403 (144 worldwide citation)

A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond ...


9
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da Yuan Shih: Angled flying lead wire bonding process. International Business Machines Corporation, Daniel P Morris, March 4, 2003: US06526655 (139 worldwide citation)

A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond ...


10
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da Yuan Shih: Integrated compliant probe for wafer level test and burn-in. IBM Corporation, March 4, 2003: US06528984 (114 worldwide citation)

The present invention is directed to a structure comprising a substrate having a surface; a plurality of elongated electrical conductors extending away from the surface; each of said elongated electrical conductors having a first end affixed to the surface and a second end projecting away from the s ...