1
Brian S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, December 6, 1994: US05371654 (318 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


2
Brian S Beaman, Keith E Fogel, Paul A Lauro, Maurice H Norcott, Da Yuan Shih, George F Walker: Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer. International Business Machines Corporation, Daniel P Morris, June 3, 1997: US05635846 (218 worldwide citation)

A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard pack ...


3
Brain S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Method of forming a three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, July 2, 1996: US05531022 (212 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


4
Peter A Gruber, Paul A Lauro, Jae Woong Nah: Double solder bumps on substrates for low temperature flip chip bonding. International Business Machines Corporation, Daniel P Morris, Otterstedt Ellenbogen & Kammer, March 24, 2015: US08987132 (42 worldwide citation)

Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting te ...


5
Stephen W Bedell, Keith E Fogel, Paul A Lauro, Devendra Sadana: Thin substrate fabrication using stress-induced substrate spalling. International Business Machines Corporation, Robert J Eichelburg, The Law Offices of Robert J Eichelburg, August 21, 2012: US08247261 (40 worldwide citation)

A method for manufacturing a thin film direct bandgap semiconductor active solar cell device comprises providing a source substrate having a surface and disposing on the surface a stress layer having a stress layer surface area in contact with and bonded to the surface of the source substrate. Opera ...


6
Gareth G Hougham, Keith E Fogel, Paul A Lauro, Joseph Zinter Jr: Land grid array fabrication using elastomer core and conducting metal shell or mesh. International Business Machines Corporation, Scully Scott Murphy & Presser P C, Daniels P Morris Esq, June 15, 2010: US07736152 (29 worldwide citation)

Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-condu ...


7
Gareth G Hougham, Keith E Fogel, Joanna Rosner, Paul A Lauro, Sherif Goma, Joseph Zinter Jr: Interposer with electrical contact button and method. International Business Machines Corporation, Ohlandt Greeley Ruggiero & Perle L, Daniel P Morris Esq, November 21, 2006: US07137827 (16 worldwide citation)

An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The s ...


8
Peter A Gruber, Paul A Lauro, Jae Woong Nah: Double solder bumps on substrates for low temperature flip chip bonding. International Business Machines Corporation, Daniel P Morris, Otterstedt Ellenbogen & Kammer, September 9, 2014: US08828860 (13 worldwide citation)

Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting te ...


9
Stephen W Bedell, Keith E Fogel, Paul A Lauro, Devendra Sadana: Thin substrate fabrication using stress-induced spalling. International Business Machines Corporation, Robert J Eichelburg, The Law Offices of Robert J Eichelburg, May 28, 2013: US08450184 (9 worldwide citation)

Manufacturing a thin film direct bandgap semiconductor active solar cell device comprises providing a source substrate having a surface and disposing on the surface a stress layer having a stress layer surface area in contact with and bonded to the surface of the source substrate. Operatively associ ...


10
Luc L Belanger, Marc A Bergendahl, Ajay P Giri, Paul A Lauro, Valerie A Oberson, Da Yuan Shih: Structure of UBM and solder bumps and methods of fabrication. International Business Machines Corporation, DeLio & Peterson, Kelly M Nowak, Joseph Petrokaitis, August 23, 2011: US08003512 (9 worldwide citation)

Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni- ...