1
Kevin G Rivette, Irving S Rappaport, Patrick O Brien: System, method, and computer program product for developing and maintaining documents which includes analyzing a patent application with regards to the specification and claims. SmartPatents, Sterne Kessler Goldstein & Fox P L L C, May 19, 1998: US05754840 (179 worldwide citation)

A system and method for assisting in the preparation of a document, and for analyzing a document, such as a patent or patent application, are described herein. The system aids a user to verify that terms in a patent application are being used consistently. The system also facilitates editing of the ...


2
Kevin G Rivette, Irving S Rappaport, Patrick O Brien: System, method, and computer program product for comparing text portions by reference to index information. Aurigin Systems, Sterne Kessler Goldstein & Fox P L L C, January 11, 2000: US06014663 (121 worldwide citation)

A system and method for assisting in the preparation of a document, and for analyzing a document, such as a patent or patent application, are described herein. The system aids a user to verify that terms in a patent application are being used consistently. The system also facilitates editing of the ...


3
Brian Lynch, Patrick O Brien: Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating. LSI Logic Corporation, Poms Smith Lande & Rose, November 14, 1995: US05466635 (84 worldwide citation)

An interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral portion that extends laterally ...


4
Hector Wasunna Alila, Michael Thomas Clark, Elaine Verne Jones, Timothy Joe Miller, Shawn Patrick O Brien, Ganesh Madhusudan Sathe: Fused somatotropin epitopic peptides that potentiate growth hormone activity. Pfizer, Peter C Richardson, Paul H Ginsburg, Alan L Koller, March 30, 1999: US05889144 (33 worldwide citation)

This invention relates to composite somatotropin peptides comprising somatotropin epitopic amino acid sequences, and fusion proteins thereof, useful in potentiating growth hormone activity. Also disclosed are vectors and host cells useful in the recombinant production of such molecules. Vaccines con ...


5
Alexandre E Eichenberger, John Kevin Patrick O Brien, Kathryn M O Brien: Method to efficiently prefetch and batch compiler-assisted software cache accesses. International Business Machines Corporation, Stephen J Walder Jr, Matthew B Talpis, February 17, 2009: US07493452 (32 worldwide citation)

A method to efficiently pre-fetch and batch compiler-assisted software cache accesses is provided. The method reduces the overhead associated with software cache directory accesses. With the method, the local memory address of the cache line that stores the pre-fetched data is itself cached, such as ...


6
Patrick O Brien, Thomas Brown: Roadway paving apparatus. E D Etnyre & Co, Leydig Voit & Mayer, April 20, 1999: US05895173 (31 worldwide citation)

A roadway paving apparatus applies successive layers of paving material to a roadway surface so as to form a desired thickness of pavement thereon. Preferably, the apparatus comprises a hopper for hauling aggregate material (e.g., gravel, sand, and/or crushed stone) and for dispensing a curtain of f ...


7
John Lipinski, Kurt Meister, Patrick O Brien, Colin Taylor: Low NOx conditioner system for a microturbine power generating system. AlliedSignal, Ephraim Starr, Kevin Wildenstein, October 3, 2000: US06125625 (30 worldwide citation)

A microturbine power generation system includes an electrical generator, a turbine and a compressor intermediate the generator and the turbine. The turbine, compressor and electrical generator are secured together by a tieshaft. The tieshaft is prestressed such that faces of the turbine, electrical ...


8
Brian Lynch, Patrick O Brien: Interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating. LSI Logic Corporation, February 16, 1999: US05872404 (28 worldwide citation)

An interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral portion that extends laterally ...


9
Brian Lynch, Patrick O Brien: Process for manufacturing an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating. LSI Logic Corporation, Oppenheimer Poms Smith, December 16, 1997: US05698465 (25 worldwide citation)

A process where in an interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral portion tha ...


10
Michael Norman Day, Michael Karl Gschwind, John Kevin Patrick O Brien, Kathryn O Brien: System and method for speculative thread assist in a heterogeneous processing environment. International Business Machines Corporation, VanLeeuwen & VanLeeuwen, Matthew B Talpis, July 3, 2012: US08214808 (14 worldwide citation)

A system and method for speculative assistance to a thread in a heterogeneous processing environment is provided. A first set of instructions is identified in a source code representation (e.g., a source code file) that is suitable for speculative execution. The identified set of instructions are an ...