1
Panayotis C Andricacos, Kirk G Berridge, John O Dukovic, Matteo Flotta, Jose Ordonez, Helmut R Poweleit, Jeffrey S Richter, Lubomyr T Romankiw, Otto P Schick, Frank Spera, Kwong Hon Wong: Vertical paddle plating cell. International Business Machines Corporation, Stephen S Strunck, Francis L Conte, May 14, 1996: US05516412 (166 worldwide citation)

An electroplating cell includes a floor, ceiling, front wall, and back wall forming a box having first and second opposite open ends. A rack for supporting an article to be electroplated is removably positioned vertically to close the first open end and includes a thief laterally surrounding the art ...


2
Panayotis C Andricacos, Kirk G Berridge, John O Dukovic, Helmut R Poweleit, Jeffrey S Richter, Lubomyr T Romankiw, Otto P Schick: Electroplating workpiece fixture. International Business Machines Corporation, Stephen S Strunck, Francis L Conte, June 4, 1996: US05522975 (70 worldwide citation)

A fixture for supporting a workpiece in a processing cell includes a frame and cooperating workpiece holder. The frame includes a head having a hole therein which receives an integral plateau of the holder. The holder plateau includes an annular seal adjacent a perimeter thereof with a vacuum port d ...


3
Panayotis C Andricacos, Shyng Tsong Chen, John M Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan, Wei Tsu Tseng, Philippe M Vereecken: Selective capping of copper wiring. International Business Machines Corporation, Connolly Bove Lodge & Hutz, Robert M Trepp, March 7, 2006: US07008871 (50 worldwide citation)

Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during electroetching and/or electroplating ...


4
Panayotis C Andricacos, Jei Wei Chang, Bojan Petek, Lubomyr T Romankiw: Thin film structures for magnetic recording heads. International Business Machines Corporation, Scully Scott Murphy & Presser, July 21, 1992: US05132859 (35 worldwide citation)

A magnetic thin film structure comprising a first layer of magnetic material having a low anisotropy H.sub.k magnetically coupled to a second layer magnetic material having a high anisotropy H.sub.k and a low coercivity. The laminate provides a dual anisotropy behavior such that the laminate exhibit ...


5
Kenneth P Rodbell, Panayotis C Andricacos, Cyril Cabral Jr, Lynne M Gignac, Cyprian E Uzoh, Peter S Locke: Method for plating copper conductors and devices formed. International Business Machines Corporation, Robert M Trepp, February 5, 2002: US06344129 (25 worldwide citation)

A method for plating copper conductors on an electronic substrate and devices formed are disclosed. In the method, an electroplating copper bath that is filled with an electroplating solution kept at a temperature between about 0° C. and about 18° C. is first provided. A copper layer on the electron ...


6
John O Dukovic, William E Corbin Jr, Erick G Walton, Peter S Locke, Panayotis C Andricacos, James E Fluegel, Evan Patton, Jonathan Reid: Method of controlling chemical bath composition in a manufacturing environment. International Business Machines Corporation, Novellus Systems, Howard J Walter Jr, October 29, 2002: US06471845 (20 worldwide citation)

A method for controlling the composition of a chemical bath in which predictive dosing is used to account for changes in the composition of the bath in which the operating characteristics of the process are partitioned into a plurality of operating modes and the consumption or generation of material ...


7
Panayotis C Andricacos, Shyng Tsong Chen, John M Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan, Wei Tsu Tseng, Philippe M Vereecken: Selective capping of copper wiring. International Business Machines Corporation, Connolly Bove Lodge & Hutz, Robert Trepp, March 13, 2007: US07190079 (19 worldwide citation)

Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during electroetching and/or electroplating ...


8
Panayotis C Andricacos, John O Dukovic, Lubomyr T Romankiw: Method for controlling chemical species concentration. International Business Machines Corporation, Louis J Percello, October 4, 1994: US05352350 (18 worldwide citation)

A method is described for maintaining constant chemical composition in solutions used for wet chemical processing. All chemical species that are deliberately included in the bath are kept at constant concentration primarily by a method of compensating for their depletion or generation with a set of ...


9
Panayotis C Andricacos, Jei Wei Chang, Wilma J Horkans, Judith D Olsen, Bojan Petek, Lubomyr T Romankiw: High magnetic moment materials and process for fabrication of thin film heads. International Business Machines Corporation, Scully Scott Murphy & Presser, December 10, 1996: US05582927 (18 worldwide citation)

Certain alloys of CoFeCu are provided in film and laminate form which have a unique combination of electromagnetic properties which enable them to be used as magnetic thin films in magnetic recording heads, shields and flux guides. The films and laminates thereof are electrodeposited from a plating ...


10
Panayotis C Andricacos, I Chia Chang, Hariklia Deligianni, Wilma J Horkans: Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition. International Business Machines Corporation, Ratner & Prestia, January 31, 1995: US05385661 (15 worldwide citation)

An acidic electrolytic solution for use in the electrodeposition of copper-rich alloys on a substrate, the less noble component being incorporated by underpotential deposition. The solution includes a first salt containing copper cations; a second salt containing cations of a metal less noble than c ...