1
Lily Khor, Ong King Hoo: Flip-chip on lead frame. Carsem Semiconductor SDN BHD, Weingarten Schurgin Gagnebin & Lebovici, November 19, 2002: US06482680 (193 worldwide citation)

There is disclosed a flip-chip-type method of assembling semiconductor devices. The proposed invention offer one step encapsulation process to promote adhesion of die to the lead finger and prevent the potential of shorts from developing between the adjacent bumps (


2
Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar: Method of reducing memory card edge roughness by edge coating. SanDisk Technologies, Vierra Magen Marcus & DeNiro, August 9, 2011: US07994647

A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or mo ...


3
Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar: Method of reducing memory card edge roughness by edge coating. SanDisk Corporation, Vierra Magen Marcus & DeNiro, October 12, 2010: US07811859

A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or mo ...


4
Hem Takiar, Shrikar Bhagath, Chin Tien Chiu, Ong King Hoo: Method of fabricating a film-on-wire bond semiconductor device. Vierra Magen Sandisk Corporation, June 5, 2008: US20080131998-A1

A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first and second semiconductor die are separated by a low profile intermediate adhesive layer in which the wire bond loops from the first semiconductor die are e ...


5
Hem Takiar, Shrikar Bhagath, Chin Tien Chiu, Ong King Hoo: Film-on-wire bond semiconductor device. Vierra Magen Sandisk Corporation, June 5, 2008: US20080128879-A1

A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first and second semiconductor die are separated by a low profile intermediate adhesive layer in which the wire bond loops from the first semiconductor die are e ...


6
Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar: Method of reducing memory card edge roughness by edge coating. Sandisk Corporation, Vierra Magen Sandisk Corporation, February 3, 2011: US20110024891-A1

A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or mo ...


7
Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar: Method of reducing memory card edge roughness by edge coating. Vierra Magen Sandisk Corporation, April 2, 2009: US20090085232-A1

A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or mo ...