1
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka: Electrolytic processing apparatus. Squire Sanders & Dempsey, February 15, 2007: US20070034502-A1

An electrolytic processing apparatus is used to remove a metal film formed on a surface of a substrate. The electrolytic processing apparatus includes a feeding electrode 31 for feeding electricity to a metal film 6 on a substrate W, a processing electrode 32 for processing the metal film 6, a subst ...


2
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka, Hariklia Deligianni, Emanuel Israel Cooper, Philippe Mark Vereecken: Electrolytic processing method. Squire Sanders & Dempsey, February 15, 2007: US20070034525-A1

An electrolytic processing method is used to remove a metal film formed on a surface of a substrate. The electrolytic processing method includes providing a feeding electrode 31 and a processing electrode 32 on a table 12, providing an insulating member 36 between the feeding electrode and the proce ...


3
Masamichi Nakashiba, Norio Kimura, Isamu Watanabe, Kaori Yoshida: Apparatus for and method for polishing workpiece. Ebara Corporation, Wenderoth Lind & Ponack, June 9, 1998: US05762539 (73 worldwide citation)

A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for s ...


4
Masayoshi Hirose, Manabu Tsujimura, Seiji Ishikawa, Norio Kimura, You Ishii: Polishing apparatus. Ebara Corporation, Wenderoth Lind & Ponack, December 19, 1995: US05476414 (68 worldwide citation)

A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressu ...


5
Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Masako Kodera, Shirou Mishima, Atsushi Shigeta, Masayoshi Hirose, Norio Kimura, Seiji Ishikawa: Polishing apparatus. Kabushiki Kaisya Toshiba, Ebara Corporation, Wenderoth Lind & Ponack, April 1, 1997: US05616063 (60 worldwide citation)

A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and i ...


6
Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura, Hiroaki Inoue, Norio Kimura, Tetsuo Matsuda, Hisashi Kaneko, Nobuo Hayasaka, Katsuya Okumura, Manabu Tsujimura, Toshiyuki Morita: Plating apparatus. Ebara Corporation, Kabushiki Kaisha Toshiba, Wenderoth Lind & Ponack L, October 14, 2003: US06632335 (57 worldwide citation)

A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion


7
Masayoshi Hirose, Seiji Ishikawa, Norio Kimura, Kiyotaka Kawashima, You Ishii: Polishing apparatus. Ebara Corporation, Wenderoth Lind & Ponack, January 31, 1995: US05384986 (53 worldwide citation)

A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface ...


8
Norio Kimura, Fumihiko Sakata, Tamami Takahashi: Polishing endpoint detection method. Ebara Corporation, Wenderoth Lind & Ponack, June 17, 1997: US05639388 (50 worldwide citation)

An endpoint detection in a polishing process of a polishing object which has a first layer and a second layer, formed under the first layer, is performed by holding the polishing object on a top ring and pressing a surface of the first layer of the polishing object onto a polishing cloth mounted on ...


9
Satoshi Mori, Masao Matsumura, Yoichi Kanemitsu, Takeshi Yoshioka, Masaaki Kajiyama, Fumio Kondo, Yuji Shirao, Masato Eguchi, Hiroyuki Shinozaki, Yukio Ikeda, Masayoshi Hirose, Masaru Nakaniwa, Norio Kimura, Katsuaki Usui, Katsuyuki Aoki: Magnetic levitation conveyor apparatus. Ebara Corporation, Armstrong Westerman Hattori McLeland & Naughton, June 24, 1997: US05641054 (45 worldwide citation)

A magnetic levitation conveyor apparatus has levitation electromagnets, linear motors, and displacement sensors which are disposed outside of a tunnel, and a carriage of simple structure which is movable in the tunnel. The carriage is of canned structure for preventing gases from being generated. Th ...


10
Katsuya Okumura, Tohru Watanabe, Riichirou Aoki, Hiroyuki Yano, Masako Kodera, Atsushi Shigeta, You Ishii, Norio Kimura, Masayoshi Hirose, Yukio Ikeda: Method and apparatus for polishing a workpiece. Kabushiki Kaisha Toshiba, Ebara Corporation, Wenderoth Lind & Ponack, March 21, 1995: US05398459 (44 worldwide citation)

A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surfac ...



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