1
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka: Electrolytic processing apparatus. Squire Sanders & Dempsey, February 15, 2007: US20070034502-A1

An electrolytic processing apparatus is used to remove a metal film formed on a surface of a substrate. The electrolytic processing apparatus includes a feeding electrode 31 for feeding electricity to a metal film 6 on a substrate W, a processing electrode 32 for processing the metal film 6, a subst ...


2
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka, Hariklia Deligianni, Emanuel Israel Cooper, Philippe Mark Vereecken: Electrolytic processing method. Squire Sanders & Dempsey, February 15, 2007: US20070034525-A1

An electrolytic processing method is used to remove a metal film formed on a surface of a substrate. The electrolytic processing method includes providing a feeding electrode 31 and a processing electrode 32 on a table 12, providing an insulating member 36 between the feeding electrode and the proce ...


3
Masamichi Nakashiba, Norio Kimura, Isamu Watanabe, Kaori Yoshida: Apparatus for and method for polishing workpiece. Ebara Corporation, Wenderoth Lind & Ponack, June 9, 1998: US05762539 (69 worldwide citation)

A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for s ...


4
Masayoshi Hirose, Manabu Tsujimura, Seiji Ishikawa, Norio Kimura, You Ishii: Polishing apparatus. Ebara Corporation, Wenderoth Lind & Ponack, December 19, 1995: US05476414 (67 worldwide citation)

A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressu ...


5
Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Masako Kodera, Shirou Mishima, Atsushi Shigeta, Masayoshi Hirose, Norio Kimura, Seiji Ishikawa: Polishing apparatus. Kabushiki Kaisya Toshiba, Ebara Corporation, Wenderoth Lind & Ponack, April 1, 1997: US05616063 (58 worldwide citation)

A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and i ...


6
Masayoshi Hirose, Seiji Ishikawa, Norio Kimura, Kiyotaka Kawashima, You Ishii: Polishing apparatus. Ebara Corporation, Wenderoth Lind & Ponack, January 31, 1995: US05384986 (53 worldwide citation)

A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface ...


7
Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura, Hiroaki Inoue, Norio Kimura, Tetsuo Matsuda, Hisashi Kaneko, Nobuo Hayasaka, Katsuya Okumura, Manabu Tsujimura, Toshiyuki Morita: Plating apparatus. Ebara Corporation, Kabushiki Kaisha Toshiba, Wenderoth Lind & Ponack L, October 14, 2003: US06632335 (49 worldwide citation)

A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion


8
Norio Kimura, Fumihiko Sakata, Tamami Takahashi: Polishing endpoint detection method. Ebara Corporation, Wenderoth Lind & Ponack, June 17, 1997: US05639388 (49 worldwide citation)

An endpoint detection in a polishing process of a polishing object which has a first layer and a second layer, formed under the first layer, is performed by holding the polishing object on a top ring and pressing a surface of the first layer of the polishing object onto a polishing cloth mounted on ...


9
Katsuya Okumura, Tohru Watanabe, Riichirou Aoki, Hiroyuki Yano, Masako Kodera, Atsushi Shigeta, You Ishii, Norio Kimura, Masayoshi Hirose, Yukio Ikeda: Method and apparatus for polishing a workpiece. Kabushiki Kaisha Toshiba, Ebara Corporation, Wenderoth Lind & Ponack, March 21, 1995: US05398459 (44 worldwide citation)

A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surfac ...


10
Norio Kimura, Takayoshi Kawamoto, You Ishii, Katsuyuki Aoki, Kunio Tateishi, Hozumi Yasuda, Keisuke Namiki: Method and apparatus for polishing workpiece. Ebara Corporation, Wenderoth Lind & Ponack, July 29, 1997: US05651724 (44 worldwide citation)

A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ...



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