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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 31, 2013: US08618659 (70 worldwide citation)

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first ...


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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Norihito Masuda, Belgacem Haba, Ilyas Mohammed: Microelectronic package with stacked microelectronic elements and method for manufacture thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 16, 2013: US08487421 (17 worldwide citation)

A microelectronic package may include a stacked microelectronic unit including at least first and second vertically stacked microelectronic elements each having a front face facing a top surface of the package. The front face of the first element may be adjacent the top surface, and the first elemen ...


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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Chip with sintered connections to package. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 3, 2013: US08525338 (1 worldwide citation)

A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge su ...


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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Semiconductor chip package assembly and method for making same. Tessera Research, December 13, 2012: US20120313238-A1

A microelectronic assembly may include a substrate containing a dielectric element having first and second opposed surfaces. The dielectric element may include a first dielectric layer adjacent the first surface, and a second dielectric layer disposed between the first dielectric layer and the secon ...


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Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Wei Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Semiconductor chip assembly and method for making same. Tessera, June 21, 2012: US20120155055-A1

A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid di ...


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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, November 8, 2012: US20120280386-A1

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first ...


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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Chip with sintered connections to package. Teresa, December 13, 2012: US20120313264-A1

A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge su ...


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Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Semiconductor chip package assembly and method for making same. Tessera Research, November 15, 2012: US20120286416-A1

A microelectronic assembly may include a microelectronic element having a plurality of element contacts at a face thereof, and a compliant dielectric element having a Young's modulus of less than about two gigapascal (GPa) and substrate contacts at a first surface joined to the element contacts. The ...


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Belgacem Haba Belgacem (Bel) Haba
Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg, Hiroaki Sato, Kiyoaki Hashimoto: Fan-out wlp with package. c o Tessera, December 13, 2012: US20120313253-A1

A microelectronic package includes a microelectronic unit and a substrate. The microelectronic unit includes a microelectronic element having contacts on a front face. A dielectric material has a first surface substantially flush with the front face of the microelectronic element. Conductive traces ...


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Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 29, 2015: US09224717 (33 worldwide citation)

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conduct ...