1
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component comprising an encapsulant. Nuvotronics, Sherr & Vaughn PLLC, August 24, 2010: US07781727 (151 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


2
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component with encapsulant. Rohm and Haas Electronic Materials, Jonathan D Baskin, April 24, 2007: US07208725 (150 worldwide citation)

Provided are optoelectronic components which include a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant filling the trench frush to the front surface, wherein the encapsulant provides an optical surface.


3
David Sherrer
David W Sherrer, Noel A Heiks: Wafer-level optoelectronic device substrate. Rohm and Haas Electronic Materials, Jonathan D Baskin, October 30, 2007: US07288758 (148 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


4
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component with flip-chip mounted optoelectronic device. Samsung Electronics, Sughrue Mion PLLC, November 1, 2011: US08049161 (148 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


5
David Sherrer
Carl E Gaebe, Noel A Heiks, David W Sherrer: Micro-optical device. Rohm and Haas Electronic Materials, Jonathan D Baskin, April 1, 2008: US07352924 (6 worldwide citation)

The present invention provides a micro-optical device which may be used as an optical pigtailing assembly for waveguides. In an exemplary configuration the assembly includes a first chip which includes an optoelectronic component and an optical fiber. The optical fiber and optoelectronic component a ...


6
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component having electrical connection and formation method thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, April 8, 2008: US07355166 (4 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


7
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component with front to side surface electrical conductor. Rohm and Haas Electronic Materials, Jonathan D Baskin, March 25, 2008: US07348550 (3 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


8
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component having passively aligned optoelectronic device. Rohm and Haas Electronic Materials, Jonathan D Baskin, October 30, 2007: US07288756 (3 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a substrate having a first surface, a second surface opposite the first surface and a trench in the first surface, the trench including a bottom surface. An optoelectronic device is in the trench mounted directly to th ...


9
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component. Rohm and Haas Electronic Materials, Jonathan D Baskin, November 6, 2007: US07291833 (2 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device mounted on a silicon substrate and a flexible circuit electrically connected to the optoelectronic device.


10
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component including optoelectronic device flip-chip mounted to substrate and conductor extending through the substrate. Samsung Electronics, Sughrue Mion PLLC, November 13, 2012: US08309908 (2 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.



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