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Terunao Hanaoka, Kenji Wada, Nobuaki Hashimoto, Haruki Ito, Kazushige Umetsu, Fumiaki Matsushima: Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity. Seiko Epson Corporation, Oliff & Berridge, December 23, 2003: US06667551 (134 worldwide citation)

A method of manufacturing a semiconductor device comprises a step of forming a through-hole in a semiconductor chip having an electrode and forming a conductive layer on a region comprising an inner side of the through-hole. An intermediate portion of the through-hole is formed to be larger than an ...


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Nobuaki Hashimoto: Semiconductor device with a plurality of stacked boards and method of making. Seiko Epson Corporation, Oliff & Berridge, April 8, 2003: US06545228 (98 worldwide citation)

A semiconductor device includes a semiconductor chip and a substrate having an interconnecting pattern formed thereover. The substrate has the semiconductor chip mounted on one surface thereof. The substrate has an outline larger than the semiconductor chip. First terminals are formed in a region ou ...


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Nobuaki Hashimoto: Electronic part including a thin body of molding resin. Seiko Epson Corporation, Loeb & Loeb, March 17, 1998: US05729437 (80 worldwide citation)

A leadless package type electronic part, the cost and the size of which can be reduced and which exhibits excellent reliability, and an electronic part material for manufacturing the electronic parts. The electronic part of a leadless package type includes a rectangular substrate having a plurality ...


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Nobuaki Hashimoto, Norio Nakamura, Hiroyuki Suemori, Hiroshi Sugai, Norio Imaoka, Kazuyoshi Noake: Card type semiconductor device. Seiko Epson Corporation, Oliff & Berridge, October 13, 1998: US05821614 (78 worldwide citation)

A card type semiconductor device includes a main circuit board and a first sub-circuit-board equipped with a main memory. The main circuit board is connected to the first sub-circuit-board through an FPC. A first TCP equipped with the CPU and a second TCP equipped with the I/O sub-system chip are mo ...


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Nobuaki Hashimoto: Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, November 19, 2002: US06483718 (58 worldwide citation)

A semiconductor device includes a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon. The substrates are stacked each other. The upper and lower ones of the semiconductor chips mounted on a pair of the stacked ...


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Nobuaki Hashimoto: Semiconductor device and method of making the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, July 3, 2001: US06255737 (54 worldwide citation)

A semiconductor device with a package size close to its chip size is, apart from a stress absorbing layer, such as to effectively absorb thermal stresses. A semiconductor device (


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Kunio Suzuki, Yukitoshi Takahashi, Nobuaki Hashimoto: Apparatus for automatically mounting and removing printing plates in rotary printing press. Tokyo Kikai Seisakusho, Trexler Bushnell Giangiorgi & Blackstone, March 1, 1988: US04727807 (54 worldwide citation)

In a rotary printing press, an apparatus, for automatically mounting and removing printing plates comprises: a magazine associated with a main body and including a plate take-out unit for positioning a plurality of successive fresh printing plates in order, and a plate storage unit for temporarily s ...


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Terunao Hanaoka, Kenji Wada, Nobuaki Hashimoto, Haruki Ito, Kazushige Umetsu, Fumiaki Matsushima: Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment. Seiko Epson Corporation, Oliff & Berridge, February 8, 2005: US06852621 (53 worldwide citation)

A method of manufacturing a semiconductor device comprises a step of forming a through-hole in a semiconductor chip having an electrode and forming a conductive layer on a region comprising an inner side of the through-hole. An intermediate portion of the through-hole is formed to be larger than an ...



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