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Belgacem Haba Belgacem (Bel) Haba
Ronald Green, Belgacem Haba, David William Wallis, Nicholas J Colella: Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 21, 2010: US07855623 (1 worldwide citation)

A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Jae M Park, Teck Gyu Kang, Nicholas J Colella: Microelectronic assemblies with springs. Tessers, Lerner David Littenberg Krumholz & Mentlik, December 4, 2007: US07304376 (1 worldwide citation)

A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, r ...


3
Belgacem Haba Belgacem (Bel) Haba
Ronald Green, Belgacem Haba, David William Wallis, Nicholas J Colella: Low loss RF transmission lines. Tessera, Tessera, LERNER DAVID et al, December 25, 2008: US20080315977-A1

A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Jae M Park, Teck Gyu Kang, Nicholas J Colella: Microelectronic assemblies with springs. Tessera, Lerner David Litenberg Krumholz & Mentlik, February 24, 2005: US20050040540-A1

A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, r ...


5
Fred Mitlitsky, Joel B Truher, James L Kaschmitter, Nicholas J Colella: Fabrication of polycrystalline thin films by pulsed laser processing. Regents of the University of California, L E Carnahan, Henry P Sartorio, February 3, 1998: US05714404 (68 worldwide citation)

A method for fabricating polycrystalline thin films on low-temperature (or high-temperature) substrates which uses processing temperatures that are low enough to avoid damage to the substrate, and then transiently heating select layers of the thin films with at least one pulse of a laser or other ho ...


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Nicholas J Colella, George G Chadwick: Wireless communication system, apparatus and method using an atmospheric platform having a wideband trunkline. Marc Arnold, J Michael Johnson, Elizabeth E Leitereg, August 24, 2004: US06781968 (42 worldwide citation)

A system, apparatus and method provide wireless communications to a geographical area. The system includes at least one atmospheric platform serving as a central relay or node using a star network topology for the geographic area. The atmospheric platform carries a payload that comprises communicati ...


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Nicholas J Colella, Howard L Davidson, John A Kerns, Daniel M Makowiecki: Composite material having high thermal conductivity and process for fabricating same. Regents of the University of California, L E Carnahan, July 21, 1998: US05783316 (37 worldwide citation)

A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and co ...


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David B Tuckerman, Kenneth Allen Honer, Bruce M McWilliams, Nicholas J Colella, Charles Liam Goudge: Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture. Tessera, Lerner David Littenbur Krumholz & Mentlik, July 28, 2009: US07566853 (21 worldwide citation)

Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated ...


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Philip Damberg, Nicholas J Colella: Packaged systems with MRAM. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 21, 2009: US07521785 (15 worldwide citation)

A semiconductor assembly includes plural chips stacked one above the other. One or more of the chips is a magnetic random access memory (MRAM). Use of MRAM alleviates problems caused by heat dissipation in the stack.


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Nicholas J Colella, Howard L Davidson, John A Kerns, Daniel M Makowiecki: Process for fabricating composite material having high thermal conductivity. The Regents of the University of California, L E Carnahan, Alan H Thompson, July 24, 2001: US06264882 (11 worldwide citation)

A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and co ...