1
Srinivasan Kodaganallur Ganapathi, Nicholas Ian Buchan, Kurt Edward Petersen, Ravindra V Shenoy, Peng Cheng Lin, Ericson Cheng: Wraparound assembly for combination touch, handwriting and fingerprint sensor. QUALCOMM MEMS Technologies, Weaver Austin Villeneuve & Sampson, May 13, 2014: US08724038 (37 worldwide citation)

This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, ...


2
Philip Jason Stephanou, Nicholas Ian Buchan, David William Burns, Kristopher Andrew Lavery, Srinivasan Kodaganallur Ganapathi: Touchscreen with bridged force-sensitive resistors. QUALCOMM MEMS Technologies, Weaver Austin Villeneuve & Sampson, May 5, 2015: US09024910 (22 worldwide citation)

A touch sensor may include a digital resistive touch (DRT) sensor architecture that is substantially free of air gaps. The DRT touch sensor may include a layer of force-sensitive resistor (FSR) material on an array of row and column electrodes. The electrodes may be formed on a substantially transpa ...


3
Srinivasan Kodaganallur Ganapathi, Nicholas Ian Buchan, David William Burns, Thad William Smith, Ion Elinor Opris: Controller architecture for combination touch, handwriting and fingerprint sensor. QUALCOMM MEMS Technologies, Weaver Austin Villeneuve & Sampson, June 3, 2014: US08743082 (21 worldwide citation)

A separate control system may be configured for a combined sensor device. Alternatively, at least part of the control system may be included in another device, such as a processor of a mobile device. Software for handwriting, touch and fingerprint detection may be included in the control system. Low ...


4
Kostadin Dimitrov Djordjev, Leonard Eugene Fennell, Nicholas Ian Buchan, David William Burns, Samir K Gupta, Sanghoon Bae: Display with peripherally configured ultrasonic biometric sensor. QUALCOMM Incorporated, Weaver Austin Villeneuve & Sampson, April 26, 2016: US09323393 (14 worldwide citation)

Various techniques and apparatuses are disclosed that provide for pixelated display modules that integrate an ultrasonic fingerprint or biometric sensing capability. In some implementations, the ultrasonic fingerprint sensor and the display components of the display module may share a common backpla ...


5
Leonard Eugene Fennell, Nicholas Ian Buchan, David William Burns, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, Jack Conway Kitchens II, John Keith Schneider, Nathaniel Robert Bennett, Kristopher Andrew Lavery: Ultrasonic sensor with bonded piezoelectric layer. SNAPTRACK, Weaver Austin Villeneuve & Sampson QUAL, July 31, 2018: US10036734

This disclosure provides systems, methods and apparatus related to an ultrasonic sensor for detecting ultrasonic energy. In some implementations, the ultrasonic sensor includes a piezoelectric receiver layer bonded with an adhesive to an array of pixel circuits disposed on a substrate, each pixel ci ...


6
Justin Phelps Black, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Kurt Edward Peterson, Cenk Acar, Ravindra Vaman Shenoy, Nicholas Ian Buchan: Microelectromechanical system device including a metal proof mass and a piezoelectric component. Qualcomm MEMS Technologies, Weaver Austin Villeneuve & Sampson, April 7, 2015: US09000656

This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devi ...


7
Suryaprakash Ganti, Srikanth Chilukuru, Livingstone Song, Kostadin Dimitrov Djordjev, Jack Conway Kitchens, John Schneider, Nicholas Ian Buchan, Leonard Eugene Fennell, Hrishikesh Vijaykumar Panchawagh, Ashish Hinger, Nai Kuei Kuo, Kollengode Narayanan, Samir Kumar Gupta, Timothy Dickinson, Max Hamel, David William Burns, Muhammed Ibrahim Sezan, Eugene Dantsker: Ultrasonic authenticating button. QUALCOMM Incorporated, Silicon Valley Patent Group, April 17, 2018: US09945818

Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultraso ...


8
Nicholas Ian Buchan, Timothy Clark Reiley: Method and apparatus for manufacturing silicon sliders with reduced susceptibility to fractures. Chambliss Bahner & Stophel PC, Two Union Square, March 2, 2006: US20060044690-A1

A method and apparatus for manufacturing silicon sliders with reduced susceptibility to fracture of the substrate from which they are manufactured is disclosed. A monocrystalline silicon wafer is formed having an orientation in the {100} crystallographic plane. The silicon wafer includes a notch for ...


9
Charles Grosjean, Paul Merritt Hagelin, Nicholas Ian Buchan: Substrate contact for a MEMS device. Patterson & Sheridan, May 22, 2008: US20080116534-A1

One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The ...


10
Charles Grosjean, Paul Merritt Hagelin, Nicholas Ian Buchan: Substrate contact for a mems device. Patterson & Sheridan, May 22, 2008: US20080119001-A1

One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The ...