1
Nathaniel Brese Martin Bayes Martin Bayes
Nathaniel E Brese, Edit Szocs, Felix J Schwager, Michael P Toben, Martin W Bayes: Electrochemically deposited indium composites. Rohm and Haas Electronic Materials, John J Piskorski, November 19, 2013: US08585885

Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.


2
Nathaniel Brese Martin Bayes Martin Bayes
Nathaniel E Brese, Edit Szocs, Felix J Schwager, Michael P Toben, Martin W Bayes: Electrochemically deposited indium composites. Rohm and Haas Electronic Materials, John J Piskorski, Rohm and Haas Electronic Materials, March 19, 2009: US20090075102-A1

Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.


3
Nathaniel Brese Angelo Lamola
Angelo A Lamola, Nathaniel E Brese: Electronic device manufacture. Rohm and Haas Electronic Materials, S Matthew Cairns, May 9, 2006: US07041331 (1 worldwide citation)

Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.


4
Nathaniel Brese Angelo Lamola
Angelo A Lamola, Nathaniel E Brese: Electronic device manufacture. Rohm and Haas Electronic Material, S Matthew Cairns, Rohm and Haas Electronic Material, July 27, 2006: US20060167174-A1

Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.


5
Nathaniel Brese Angelo Lamola
Angelo A Lamola, Nathaniel E Brese: Electronic device manufacture. Rohm and Haas Electronic Chemicals, Edwards & Angell, December 30, 2004: US20040262751-A1

Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.


6
Nathaniel Brese
Nathaniel E Brese, Kenneth T Reilly: Small size electroluminescent phosphor. OSRAM Sylvania, Robert F Clark, July 1, 1997: US05643496 (30 worldwide citation)

An electroluminescent phosphor composed of copper activated zinc sulfide having an average particle size less than 23 micrometers and a halflife equal to or greater than the halflife of a second phosphor having a similar composition and an average particle size of at least 25 micrometers.


7
Nathaniel Brese
Nathaniel E Brese, Vaddi Butchi Reddy: Alkali iodide doped zinc sulfide electroluminescent phoshor. Osram Sylvania, William H McNeill, July 18, 2000: US06090311 (8 worldwide citation)

An electroluminescent phosphor containing an alkali iodide dopant, such as lithium iodide or potassium iodide, and having CIE coordinates of x=0.173 to 0.187 and y=0.392 to <0.424. The phosphor without alkali iodide dopant has CIE coordinates of x.apprxeq.0.180 to 0.184 and y.apprxeq.0.424 to 0.426. ...


8
Nathaniel Brese
Peter R Levey, Nathaniel E Brese: Catalyst composition and deposition method. Rohm and Haas Electronic Materials, John J Piskorski, March 31, 2009: US07510993 (5 worldwide citation)

Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electrole ...


9
Nathaniel Brese
Edit Szocs, Felix J Schwager, Thomas Gaethke, Nathaniel E Brese, Michael P Toben: Indium compositions. Rohm and Haas Electronic Materials, John J Piskorski, June 11, 2013: US08460533 (1 worldwide citation)

Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.


10
Nathaniel Brese
Nathaniel E Brese, Jitendra S Goela, Michael A Pickering: Silicon carbide with high thermal conductivity. Rohm and Haas Electronic Materials, John J Piskorski, October 21, 2008: US07438884 (1 worldwide citation)

A chemical vapor deposited, β phase polycrystalline silicon carbide having a high thermal conductivity and reduced stacking faults. The silicon carbide is synthesized under specific conditions using hydrogen gas and methyltrichlorosilane gas as reactants. The thermal conductivity of the silicon carb ...



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