1
Keizo Hasebe, Shinji Nagashima, Norio Semba, Masami Akimoto, Yoshio Kimura, Naruaki Iida, Kouji Harada, Issei Ueda, Nobuo Konishi: Substrate processing system. Tokyo Electron, Tokyo Electron Kyushu, Oblon Spivak McClelland Maier & Neustadt P C, October 20, 1998: US05826129 (124 worldwide citation)

This invention provides a substrate processing system including a cassette station on which at least one cassette containing a plurality of objects is placed, a process station including a plurality of process chambers for performing processing for the objects, and an object conveying unit for loadi ...


2
Mitsuhiro Nanbu, Naruaki Iida, Hideaki Gotou, Masanori Tateyama, Yuji Yoshimoto, Tomoko Ishimoto, Hidetami Yaegashi, Yasunori Kawakami, Takahide Fukuda, Akihiro Fujimoto, Takashi Takekuma, Hiroyuki Matsukawa: Apparatus for processing substrates having a film formed on a surface of the substrate. Tokyo Electron, Tokyo Electron Kyushu, Oblon Spivak McClelland Maier & Neustadt P C, October 15, 1996: US05565034 (92 worldwide citation)

A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and ...


3
Jun Ohkura, Naruaki Iida, Hiroyuki Kudou, Masanori Tateyama, Yasuhiro Sakamoto: Substrate processing apparatus and substrate processing method. Tokyo Electron, Oblon Spivak McClelland Maier & Neustadt P C, September 2, 1997: US05664254 (70 worldwide citation)

A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y ...


4
Masami Akimoto, Kazutoshi Yoshioka, Naruaki Iida: Method for processing wafer-shaped substrates. Tokyo Electron, Tokyo Electron Kyushu, Oblon Spivak McClelland Maier & Neustadt, October 24, 1995: US05460478 (68 worldwide citation)

An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the proce ...


5
Masami Akimoto, Kazutoshi Yoshioka, Naruaki Iida: Apparatus for processing wafer-shaped substrates. Tokyo Electron, Tokyo Electron Kyushu, Oblon Spivak McClelland Maier & Neustadt, November 15, 1994: US05364222 (62 worldwide citation)

An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the proce ...


6
Mitsuhiro Nanbu, Naruaki Iida, Hideaki Gotou, Masanori Tateyama, Yuji Yoshimoto, Tomoko Ishimoto, Hidetami Yaegashi, Yasunori Kawakami, Takahide Fukuda, Akihiro Fujimoto, Takashi Takekuma, Hiroyuki Matsukawa: Method of substrate processing to form a film on multiple target objects. Tokyo Electron, Tokyo Electron Kyushu, Oblon Spivak McClelland Maier & Neustadt P C, April 25, 2000: US06054181 (43 worldwide citation)

A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal dir ...


7
Mitsuhiro Nanbu, Naruaki Iida, Hideaki Gotou, Masanori Tateyama, Yuji Yoshimoto, Tomoko Ishimoto, Hidetami Yaegashi, Yasunori Kawakami, Takahide Fukuda, Akihiro Fujimoto, Takashi Takekuma, Hiroyuki Matsukawa: Semiconductor wafer processing apparatus including localized humidification between coating and heat treatment sections. Tokyo Electron, Tokyo Electron Kyushu, Oblon Spivak McClelland Maier & Neustadt P C, March 10, 1998: US05725664 (41 worldwide citation)

An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an ...


8
Issei Ueda, Shinichi Hayashi, Naruaki Iida, Yuji Matsuyama, Yoichi Deguchi: Substrate processing apparatus and substrate processing method. Tokyo Electron, Rader Fishman & Grauer PLLC, October 29, 2002: US06471422 (36 worldwide citation)

Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrat ...


9
Seiji Nakano, Michiaki Matsushita, Naruaki Iida, Suguru Enokida, Katsuhiro Morikawa: Device and method for supporting a substrate. Tokyo Electron, Burr & Brown, September 10, 2013: US08528889 (35 worldwide citation)

A substrate support device including a support member having a lower-surface support section to support a lower surface of a substrate; and a position restriction section provided on the lower-surface support section, the position restriction section being formed to surround a periphery of the subst ...


10
Issei Ueda, Shinichi Hayashi, Naruaki Iida, Yuji Matsuyama, Yoichi Deguchi: Substrate processing apparatus and substrate processing method. Tokyo Electron, Rader Fishman & Grauer PLLC, January 6, 2004: US06672779 (24 worldwide citation)

Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrat ...