1
Nakatani Seiichi, Hirano Kouichi: Circuit component built-in module and method for producing the same. Matsushita Electric, June 2, 1999: EP0920058-A2 (90 worldwide citation)

A circuit component built-in module of the present invention includes an insulating substrate (401) formed of a mixture comprising 70wt% to 95wt% of an inorganic filler and a thermosetting resin, a plurality of wiring patterns (402a, 402b, 402c and 402d) formed on at least a principal plane of the i ...


2
Sugaya Yasuhiro, Komatsu Shingo, Hirano Koichi, Nakatani Seiichi, Matsuoka Yasuyuki, Asahi Toshiyuki, Yamashita Yoshihisa: Transfer material, method for producing the same and wiring substrate produced by using the same. Matsushita Electric, December 18, 2002: EP1267594-A2 (82 worldwide citation)

A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer 101 as a carrier, a second metal layer 103 that is transferred to the substrate as a wiring pattern, and a peel layer 102 ...


3
Nakatani Seiichi, Yamashita Yoshihisa, Ichiyanagi Takashi, Hirano Koichi: Magnetic substance striped array sheet, rfid magnetic sheet, electromagnetic shield sheet, and manufacturing methods for them. Matsushita Electric, May 1, 2008: JP2008-103691 (60 worldwide citation)

PROBLEM TO BE SOLVED: To provide a magnetic substance striped array sheet which has a needlelike magnetic substance excellently arrayed in a predetermined striped pattern, and also has high magnetic permeability and is thin and rich in flexibility.SOLUTION: A water-repellent layer 12 is formed on a ...


4
Nakatani Seiichi, Nishiyama Tosaku, Asahi Toshiyuki, Nakanishi Seishi, Muramatsu Takeshi: Three-dimensional mounted structure, portable electronic apparatus equipped therewith and manufacturing method thereof. Matsushita Electric, September 2, 2005: JP2005-236089 (34 worldwide citation)

PROBLEM TO BE SOLVED: To provide a three-dimensional mounted structure capable of realizing higher density and higher function mounting.SOLUTION: The three-dimensional mounted structure 100 is provided with a first main wiring board 11, a second main wiring board 12 arranged in parallel to the first ...


5
Asahi Toshiyuki, Sugaya Yasuhiro, Komatsu Shingo, Nakatani Seiichi: Component built-in module and method of manufacturing the same. Matsushita Electric, July 24, 2002: EP1225629-A2 (25 worldwide citation)

A component built-in module includes an electric insulation layer 101, first wiring patterns 102a and 102b in a plurality of layers that are laminated with the electric insulation layer 101 being interposed therebetween, at least one first inner via 104 electrically connecting the first wiring patte ...


6
Kawakita Kouji, Nakatani Seiichi, Ogawa Tatsuo, Suehiro Masatoshi, Iwaisako Kouichi, Akiyama Hideo: Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same.. Matsushita Electric, Dai Ichi Kogyo Seiyaku, Dowa Mining Co, May 3, 1995: EP0651602-A1 (24 worldwide citation)

A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 mu m and specific surface of from 0.1 to 1.5 m/g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temp ...


7
Asahi Toshiyuki, Sugaya Yasuhiro, Komatsu Shingo, Nakatani Seiichi, Yamamoto Yoshiyuki: Method for producing a component built-in module. Matsushita Electric, April 23, 2003: EP1304742-A2 (21 worldwide citation)

A component built-in module includes an insulating layer (101), wirings (102, 106) integrated with both surfaces of the insulating layer (101), a via (103) connecting the wirings (102, 106), and one or more components (104) selected from an electronic component and a semiconductor, which is embedded ...


8
Yamashita Yoshihisa, Hirano Koichi, Shimizu Masanori, Nakatani Seiichi: Heat conduction wiring board for led lighting device, led lighting device using the same, and method of manufacturing them. Matsushita Electric, February 5, 2004: JP2004-039691 (21 worldwide citation)

PROBLEM TO BE SOLVED: To provide an LED lighting device which can be reduced in size by increasing its mounting density or improved in brightness as keeping unchanged in size.SOLUTION: A heat conduction wiring board 11 is used, which is equipped with an insulating layer 13 containing a resin composi ...


9
Sugaya Yasuhiro, Hirano Koichi, Nakatani Seiichi, Matsuoka Yasuyuki, Yuuhaku Satoru, Asahi Toshiyuki: Circuit component built-in module, radio device having the same, and method for producing the same. Matsushita Electric, June 27, 2001: EP1111674-A2 (20 worldwide citation)

A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a first mixture 105 and a second mixture 106, wiri ...


10
Kawakita Kouji, Nakatani Seiichi, Tsukamoto Masahide: Printed circuit board. Matsushita Electric, July 24, 1996: EP0723388-A1 (19 worldwide citation)

The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be forme ...