1
Tanaka Kazuyuki, Yoshida Hirokazu, Shinomiya Kouki, Nagura Toshikazu: Coin type rfid tag. Sankyo, Oji Paper, February 14, 2008: JP2008-033716 (74 worldwide citation)

PROBLEM TO BE SOLVED: To provide a further inexpensive coin type RFID tag, capable of ensuring a longer communicating distance and a wider communication range than before for reading and writing of data.SOLUTION: The RIFD tag comprises an IC chip mount body 1 including an annular antenna circuit 6 c ...


2
Shinomiya Koki, Nagura Toshikazu: Coin-shaped rfid tag. Oji Paper, May 21, 2009: JP2009-110144 (54 worldwide citation)

PROBLEM TO BE SOLVED: To provide a highly durable coin-shaped RFID tag in which the molded joint face of a disk-shaped edged resin case and a cover-shaped part are hardly peeled from each other even when an expansion/contraction stress is repeatedly applied due to a change in environment over time, ...


3
Yasuda Kenji, Minato Toshihiro, Kato Masaru, Nagura Toshikazu, Arakawa Hiroshi: Thermal transfer dye image-receiving sheet.. Oji Paper, January 23, 1991: EP0409597-A2 (13 worldwide citation)

A thermal transfer dye image-receiving sheet capable of receiving clear, uniform colored images without a formation of curls and wrinkles therein, comprising (A) a substrate sheet composed of (a) core sheet having a thermal shrinkage Y3 , (b) a front coated thermoplastic film layer having a thicknes ...


4
Nakamura Yoshinori C O Sony Co, Sam Huy C O Sony Corporation, Kusaka Yukio C O New Oji Paper, Hayasi Shigeo C O New Oji Pape, Nagura Toshikazu C O New Oji P: Image receiving sheet for thermal transfer printing.. Sony, New Oji Paper, June 7, 1995: EP0656264-A1 (10 worldwide citation)

An image receiving sheet for thermal transfer printing according to the present invention comprises a dye receiving layer (1), a foam film (3), an adhesive layer (4), a release layer (5), a support layer (6) and a lubricant layer (7) which are successively laminated. The image receiving sheet for th ...


5
Nagura Toshikazu, Yasuda Kenji, Tsuchiya Michinori, Shigetani Tsunehisa, Kato Masaru: Thermal transfer image-receiving sheet. Oji Paper, November 1, 1989: GB2217866-A (9 worldwide citation)

A thermal transfer image-receiving sheet for a thermal transfer type printer comprises a sheet substrate, a front coating layer formed on the front surface of the sheet substrate and comprising a polyolefin resin, a polyolefin resin back coating layer formed on the back surface of the sheet substrat ...


6
Kato Marasu, Minato Toshihiro, Nagura Toshikazu, Hasegawa Susumu, Yasuda Kenji: Support sheet for thermal transfer image-receiving sheet and method of producing same.. Oji Paper, December 27, 1989: EP0348157-A2 (7 worldwide citation)

A support sheet useful for a thermal transfer image receiving sheet having a high resistance to thermal curling and capable of recording clear and uniform images or pictures thereon, comprises a sheet substrate with a thickness of 20 to 300 mu m, and multilayer front and back surface coating plastic ...


7
Nagura Toshikazu: Ic chip package. Oji Paper, March 25, 2004: JP2004-094522 (5 worldwide citation)

PROBLEM TO BE SOLVED: To provide an IC chip package capable of performing communication at any of positions on the surface of metal and in the vicinity of metal and a position in whose periphery no metal exists.SOLUTION: This IC chip package equipped with an antenna circuit 12 and an IC 6 is provide ...


8
Nagura Toshikazu: Ic mounting body. Oji Paper, February 14, 2003: JP2003-044810 (5 worldwide citation)

PROBLEM TO BE SOLVED: To provide an IC mounting body whose manufacturing cost can be reduced drastically in comparison with the conventional manner. SOLUTION: In an inlet sheet in this invension, a circuit pattern 4 including a loop antenna is formed on one surface of a film-like base material 1, a ...


9
Nagura Toshikazu: Ic-package body. Oji Paper, November 9, 2001: JP2001-312709 (4 worldwide citation)

PROBLEM TO BE SOLVED: To provide an IC-packaged body capable of remarkably reducing the production cost in comparison with conventional one.SOLUTION: Concerning this inlet sheet, a circuit pattern 2b of copper foil containing a loop antenna is formed on one surface of a thermoplastic resin support 1 ...


10
Nagura Toshikazu: Ic chip mount body. Oji Paper, February 19, 2004: JP2004-054337 (3 worldwide citation)

PROBLEM TO BE SOLVED: To provide an IC chip mount body enabling communications at any location without being influenced by a surrounding metal body, that is, whether or not the IC chip mount body is located on the surface of the metal body.SOLUTION: In the IC chip mount body provided with an antenna ...