1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Laura Mirkarimi, Moshe Kriman: Wafer level edge stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 25, 2014: US08680662 (14 worldwide citation)

A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surf ...


2
Belgacem Haba Belgacem (Bel) Haba
Moshe Kriman, Osher Avsian, Belgacem Haba, Giles Humpston, Dmitri Burshtyn: Stacked microelectronic assemblies having vias extending through bond pads. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 18, 2013: US08466542 (2 worldwide citation)

A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelec ...


3
Belgacem Haba Belgacem (Bel) Haba
Moshe Kriman, Osher Avsian, Belgacem Haba, Giles Humpston, Dmitri Burshtyn: Stacked microelectronic assemblies having vias extending through bond pads. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, September 16, 2010: US20100230795-A1

A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelec ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Laura Mirkarimi, Moshe Kriman: Wafer level edge stacking. Tessera Research, Tessera, LERNER DAVID et al, December 24, 2009: US20090316378-A1

A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surf ...


5
Ariel Lipson, Uri Kinrot, Dalit Bahar, Moshe Kriman, Moshe Levy, Ocie Ward, Mark Harland: Miniature camera module with MEMS-actuated autofocus. DigitalOptics Corporation, Haynes and Boone, March 15, 2016: US09285654 (2 worldwide citation)

A miniature MEMS autofocus camera module includes a MEMS actuated movable lens group and at least one fixed lens group defining an optical axis within a camera module housing. Objects disposed an arbitrary distance from the camera module are automatically focused at a determined zoom to an image sen ...


6
Ariel Lipson, Uri Kinrot, Dalit Bahar, Moshe Kriman, Moshe Levy, Ocie Ward, Mark Harland: MEMS auto focus miniature camera module with fixed and movable lens groups. DigitalOptics Corporation, Haynes and Boone, March 22, 2016: US09294667 (1 worldwide citation)

A MEMS auto focus miniature camera module includes an image sensor and an optical train including at least one movable lens and one or more fixed lenses or fixed lens groups on either side of the movable lens. The movable lens provides an auto focus feature of the camera module. A MEMS actuator tran ...


7
Moshe Kriman, Hagit Avsian: Substrate for integrated modules. Lerner David Littenberg Krumholz & Mentlik, November 26, 2013: US08592233 (1 worldwide citation)

A method of fabricating a plurality of components using wafer-level processing can include bonding first and second wafer-level substrates together to form a substrate assembly, such that first surfaces of the first and second substrates confront one another, the first substrate having first electri ...


8
Ariel Lipson, Uri Kinrot, Dalit Bahar, Moshe Kriman, Moshe Levy, Ocie Ward, Mark Harland: MEMS auto focus miniature camera module with fixed and movable lens groups. DigitalOptics Corporation, November 14, 2017: US09817206

A MEMS auto focus miniature camera module includes an image sensor and an optical train including at least one movable lens and one or more fixed lenses or fixed lens groups on either side of the movable lens. The movable lens provides an auto focus feature of the camera module. A MEMS actuator tran ...


9
Giles Humpston, Moshe Kriman: Rear-face illuminated solid state image sensors. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, November 1, 2016: US09484379

A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the ...


10
Moshe Kriman, Merav Yaakoby: Methods for manufacturing a sensor assembly. N trig, March 15, 2011: US07906364

A method for connecting substrates having electrical conductive elements thereon, comprising: providing at least one spacer between the substrates; applying a conductive material to at least one of the electrical conductive elements; aligning the electrical conductive elements; and, connecting the s ...