1
Nakazawa Michiyuki, Mochizuka Seisuke, Takahashi Masaki: Surface acoustic wave filter and surface acoustic wave resonator. TDK, April 17, 2008: JP2008-092017 (9 worldwide citation)

PROBLEM TO BE SOLVED: To obtain an SAW filter having a high Q, a low insertion loss, and high damage resistance to an electrode, and also to provide an SAW resonator.SOLUTION: In the SAW filter, a plurality of crossed electrode fingers arranged in the propagation direction of surface acoustic waves ...


2
Inoue Kenji, Mochizuka Seisuke: Elastic surface wave apparatus and wave divider. TDK, April 8, 2004: JP2004-112238 (1 worldwide citation)

PROBLEM TO BE SOLVED: To obtain a low-loss high-attenuation characteristic of an elastic surface wave apparatus with a reduced number of used elastic surface wave resonators.SOLUTION: The elastic surface wave apparatus comprises input and output signal electrodes 15, 16 for inputting/outputting elec ...


3
Mochizuka Seisuke, Kihara Yoshiichi, Osanai Katsunori: Surface acoustic wave filter and duplexer. TDK, July 14, 2005: JP2005-191797 (1 worldwide citation)

PROBLEM TO BE SOLVED: To obtain wide and flat attenuation in a frequency band apart from a pass band.SOLUTION: A SAW filter is equipped with: a filter main body part 12 which has a SAW resonator arranged on a series arm and a SAW resonator arranged on a parallel arm and can form a prescribed pass ba ...


4
Mochizuka Seisuke, Takahashi Masaki, Nakazawa Michiyuki: Longitudinally coupled multi-mode resonator type surface acoustic wave filter. TDK, November 20, 2008: JP2008-283425 (1 worldwide citation)

PROBLEM TO BE SOLVED: To improve phase balance by miniaturizing a longitudinally coupled multi-mode resonator type SAW filter having a balance terminal.SOLUTION: The longitudinally coupled multi-mode filter includes a plurality of IDTs arrayed in a propagation direction of a surface acoustic wave, a ...


5
Inoue Kenji, Mochizuka Seisuke: Demultiplexer. TDK, May 13, 2004: JP2004-140508 (1 worldwide citation)

PROBLEM TO BE SOLVED: To improve attenuating characteristics between a passing band and a blocking band of a surface acoustic wave filter in a demultiplexer.SOLUTION: This demultiplexer includes a common signal terminal C, and a surface acoustic wave resonator. The demultiplexer further includes a t ...


6
Takahashi Masaki, Mochizuka Seisuke, Nakazawa Michiyuki: Longitudinal coupling resonator type surface acoustic wave filter. TDK, October 16, 2008: JP2008-252678 (1 worldwide citation)

PROBLEM TO BE SOLVED: To enhance an insertion loss and a reflection property of a longitudinal coupling resonator type surface acoustic wave (SAW) filter.SOLUTION: The SAW filter including two or more IDTs arrayed in the propagation direction of surface acoustic waves, has different electrode finger ...


7
Takahashi Masaki, Mochizuka Seisuke, Nakazawa Michiyuki: Longitudinally coupled resonator-type surface acoustic wave filter. TDK, zhangjing qiang, October 1, 2008: CN200810086904

Disclosed is a surface acoustic wave filter comprising two or more IDTs arranged in a propagation direction of the surface acoustic wave, wherein said two or more IDTs include at least one pair of IDTs arranged adjacent to each other in order to be acoustically coupled to each other, and have differ ...


8
Nakazawa Michiyuki, Mochizuka Seisuke, Takahashi Masaki: Surface acoustic wave filter and surface acoustic wave resonator. TDK, xujing, April 2, 2008: CN200710161648

A SAW filter comprises an IDT disposed on a piezo-electric substrate, wherein the IDT includes comb-shaped electrodes having a plurality of interdigital electrodes arranged in a propagation direction of surface acoustic waves and bus bars for connecting these interdigital electrodes, arranged in opp ...


9
Sato Katsuo, Kuwajima Hajime, Mochizuka Seisuke: Surface acoustic wave element and method of manufacturing the same. TDK, September 26, 2003: JP2003-273692

PROBLEM TO BE SOLVED: To provide a surface acoustic wave (SAW) element and a method of manufacturing the same in which the SAW elements are simultaneously manufactured by capturing a number of elements by using a face-down method.SOLUTION: Flip chip bonding is performed by respectively welding a plu ...


10
Mochizuka Seisuke, Nakazawa Michiyuki, Takahashi Masaki: Surface acoustic wave instrument and its manufacturing method. TDK, July 6, 2006: JP2006-180437

PROBLEM TO BE SOLVED: To improve a package shielding and an isolation characteristic for surface acoustic wave (SAW) equipment.SOLUTION: This SAW equipment is composed of a base board, the SAW element mounted in the base board, a lid that covers a SAW element, and a standard potential electrode. The ...



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